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Dip Stencil 40 x 40 mm, 300 µm, for Dip and Print Station - Ersa 0PR100-D001

ERSA
Ersa
Lead time
1 week
€446.25
Excl. 19% VAT , excl. Shipping Cost
Article
ER-0PR100-D001

Manufacturer Nr.
0PR100-D001
Dip stencil 40 x 40 mm with a 300 µm foil thickness for the Ersa Dip and Print Station 0PR100. By dipping the component it deposits a defined amount of flux or solder paste at the solder joints. Suitable for BGA and most fine-pitch components.
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Ersa 0PR100-D001. Dip-Schablone 40 x 40 mm / 300 mikrometer
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The Ersa dip stencil 40 x 40 mm is used for component preparation on the Ersa Dip and Print Station 0PR100. By dipping the component, a defined depot of flux or solder paste is created at the solder joints - suitable for BGA and most fine-pitch components.

Technical data

TypeDip stencil
Dimensions40 x 40 mm
Foil thickness300 µm
Compatible withErsa Dip and Print Station 0PR100
ApplicationFlux or solder paste application, BGA and fine-pitch
Manufacturer part number0PR100-D001
EAN4003008090796
More Information
Execution TEC
Manufacturer Nr. 0PR100-D001
Manufacturer Ersa
Country of Manufacture Germany
EAN 4003008090796
ESD equipment ESD Lötstationen
Lead time 1 week
Weight 0.100000
GPSR manufacturer information Ersa GmbH, Leonhard Karl Str. 24, DE-97877 Wertheim, www.kurtzersa.de
Article authenticity Original product
Condition of article New
Download
File Icon Ersa Soldering Tools. Catalog (en) (10.47 MB)
File Icon Ersa Lötwerkzeuge. Katalog (de) (10.49 MB)
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