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Dip stencil 40 x 40 mm with a 300 µm foil thickness for the Ersa Dip and Print Station 0PR100. By dipping the component it deposits a defined amount of flux or solder paste at the solder joints. Suitable for BGA and most fine-pitch components.

Dip Stencil 40 x 40 mm, 300 µm, for Dip and Print Station - Ersa 0PR100-D001

ERSA Original product
Net price (excl. VAT)
€446.25
Item ER-0PR100-D001
Manufacturer no. 0PR100-D001
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Brand new Specialist dealer since 2009 Original product Worldwide shipping
Product data
Manufacturer no.0PR100-D001
EAN4003008090796
Country of originGermany
ConditionNew
Article
ER-0PR100-D001

The Ersa dip stencil 40 x 40 mm is used for component preparation on the Ersa Dip and Print Station 0PR100. By dipping the component, a defined depot of flux or solder paste is created at the solder joints - suitable for BGA and most fine-pitch components.

Technical data

TypeDip stencil
Dimensions40 x 40 mm
Foil thickness300 µm
Compatible withErsa Dip and Print Station 0PR100
ApplicationFlux or solder paste application, BGA and fine-pitch
Manufacturer part number0PR100-D001
EAN4003008090796
More Information
ESD versionTEC
Manufacturer Nr.0PR100-D001
ManufacturerErsa
Country of ManufactureGermany
EAN4003008090796
ESD equipmentESD Lötstationen
Weight0.100000
GPSR manufacturer informationErsa GmbH, Leonhard Karl Str. 24, DE-97877 Wertheim, www.kurtzersa.de
Article authenticityOriginal product
Condition of articleNew
Position sensingNo