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Dip Stencil 40 x 40 mm, 300 µm, for Dip and Print Station - Ersa 0PR100-D001
Dip stencil 40 x 40 mm with a 300 µm foil thickness for the Ersa Dip and Print Station 0PR100. By dipping the component it deposits a defined amount of flux or solder paste at the solder joints. Suitable for BGA and most fine-pitch components.
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Description
The Ersa dip stencil 40 x 40 mm is used for component preparation on the Ersa Dip and Print Station 0PR100. By dipping the component, a defined depot of flux or solder paste is created at the solder joints - suitable for BGA and most fine-pitch components.
Technical data
| Type | Dip stencil |
|---|---|
| Dimensions | 40 x 40 mm |
| Foil thickness | 300 µm |
| Compatible with | Ersa Dip and Print Station 0PR100 |
| Application | Flux or solder paste application, BGA and fine-pitch |
| Manufacturer part number | 0PR100-D001 |
| EAN | 4003008090796 |
| Weight | 0.1 kg |
| Manufacturer | Ersa |
| Manufacturer Nr. | 0PR100-D001 |
| GPSR manufacturer information | Ersa GmbH, Leonhard-Karl-Straße 24, DE-97877 Wertheim, www.kurtzersa.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Germany |
| Abmessung | 40x40 |
| ESD version | TEC |
| ESD equipment | ESD Lötstationen |
Downloads
Datasheet
User Manual
Declaration of Conformity
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