Compact Hybrid Reflow Oven 50-250 °C for Reballing and QFN Prebumping - Martin MINIOVEN 05

The Martin MINIOVEN 05 is a compact, robust tabletop unit for reballing BGA components and prebumping QFN chips. The hybrid heating technology heats electronic components evenly from all sides, delivering reproducible reballing results in both development and production.

Benefits

• Even hybrid heating with 500 W lower heater (4 x IR lamps) for repeatable reflow profiles
• Set up, manage and save up to 25 heating profiles via the intuitive menu navigation
• Additional external temperature sensor for reliable automatic learning of reballing profiles
• EASYBEAM PC software to edit profiles conveniently and display the temperature history
• Process gas connection for reflow under nitrogen atmosphere

Technical data

Applications

• Reballing BGA components in repair, development and production
• Prebumping QFN devices with available component holders and fixtures
• Reflow processes under nitrogen via the process gas connection

Scope of delivery

Base unit including basic equipment with external temperature sensor (K-type), cutter knife, SMD hook, cleaning pen with three spare inserts, Kapton tape, magnifier, power cable and manual.