ESD air cushion bags - ESD (antistatic)
ESD Packaging
ESD bubble bags and films provide a dual-layer defence against electrostatic discharge during storage and transport: a conductive outer layer dissipates surface charges while a cushioned inner layer absorbs mechanical shocks. Surface resistance values of 10⁵–10¹¹ Ω (measured per IEC 61340-5-1 / DIN EN 61340-4-4) keep sensitive PCBs, ICs and semiconductor assemblies safely inside the electrostatic protected area (EPA) at all times. Multi-layer constructions combine metallic shielding (shielding attenuation >20 dB) with low-charging polyethylene foam to meet IEC 61340-5-3 packaging requirements.
As a specialist distributor for ESD packaging, esd.equipment stocks 36 products across ESD bubble bags and ESD films - sourced from qualified manufacturers and fully compliant with IEC 61340-5-1, IEC 61340-5-3 and ANSI/ESD S11.4. Every item is suitable for use within certified EPA workstations and for outgoing shipment of ESD-sensitive devices (ESDS) per JEDEC JESD625.
ESD Bubble Bags vs. Standard Bubble Bags vs. Metalized Shielding Bags - technical comparison
| Criterion | ESD Bubble Bags | Standard Bubble Bags | Metalized Shielding Bags | Pink Anti-Static Bags |
|---|---|---|---|---|
| Surface resistance | 10⁵-10¹¹ Ω | >10¹³ Ω (insulating) | 10³-10⁷ Ω | 10⁵-10¹¹ Ω |
| ESD shielding | Yes - metallic layer >20 dB | None | Yes - >20 dB | None |
| Mechanical cushioning | Yes - air-bubble layer | Yes - air-bubble layer | No | No |
| Norm compliance | IEC 61340-5-1/-5-3, ANSI/ESD S11.4 | None | ANSI/ESD S11.4 | IEC 61340-5-1 (partial) |
| Triboelectric charging | Low - dissipative material | High - insulating PE | Low | Low |
| Suitable for ESDS shipment | Yes - JEDEC JESD625 | No | Yes | Internal use only |
| Typical use case | PCB, IC, module transport & storage | General fragile goods | Hard-drive, board storage | Short-term EPA handling |
Typical application areas: Electronics manufacturing and SMT assembly lines (IEC 61340-5-1, IPC-A-610), semiconductor wafer and component handling (SEMI S1/S2, JEDEC JESD625), medical device manufacturing and packaging (ISO 13485), automotive electronics and control units (IATF 16949, VDA 6.3), aerospace and defence avionics (AS9100, IEC 61340-5-3), and laboratory handling of ESD-sensitive modules and sensors.