ESD Clogs - TEC
ESD Shoes
ESD clogs deliver a verified footwear-to-ground resistance of 10⁵ Ω to 10⁸ Ω per IEC 61340-5-1, dissipating electrostatic charges before they can damage sensitive components. Unlike standard occupational footwear, certified ESD clogs carry a system resistance < 3.5 × 10⁷ Ω when measured in a complete EPA circuit, ensuring reliable person-to-ground dissipation across vinyl, ESD mat, and raised-floor surfaces. The open-back clog design provides rapid donning in cleanroom gowning areas and semiconductor production environments while maintaining EN ISO 20347 occupational footwear compliance.
Our catalogue lists 56 ESD clog models from leading certified manufacturers, covering sizes EU 35 through EU 48, antistatic and fully dissipative classes, and variants approved to IEC 61340-5-1, EN ISO 20347:2022, and ANSI/ESD S20.20. Whether you need lightweight polypropylene clogs for short-duration assembly work or autoclavable cleanroom versions for ISO Class 5 environments, the range addresses every ESD footwear specification.
ESD Clogs - Technical comparison by class and application
| Criterion | Dissipative ESD Clog | Antistatic ESD Clog | Cleanroom ESD Clog | Standard Occupational Clog |
|---|---|---|---|---|
| Footwear resistance | 10⁵-10⁷ Ω | 10⁷-10⁸ Ω | 10⁵-10⁷ Ω | > 10¹² Ω (insulating) |
| Applicable norm | IEC 61340-5-1, EN ISO 20347 | IEC 61340-5-1 | IEC 61340-5-1, ISO 14644 | EN ISO 20347 only |
| EPA suitability | ✓ Full EPA qualification | ✓ Approved with ESD flooring | ✓ Full EPA qualification | ◼ Not approved |
| Autoclavable | Selected models | No | ✓ Yes | No |
| Particle emission | Low (smooth sole) | Low | Ultra-low, ISO Class 5 | Not controlled |
| Sole material | Carbon-filled PU/PP | Carbon-filled rubber | Carbon-filled PP | Standard EVA/rubber |
| Typical weight | ca. 180-320 g per shoe | ca. 200-350 g | ca. 160-260 g | ca. 250-450 g |
| ANSI/ESD S20.20 | ✓ Compliant | ✓ Compliant | ✓ Compliant | Not applicable |
Typical applications: Electronics assembly and SMT production (IEC 61340-5-1, IPC-A-610), semiconductor wafer handling and fab environments (SEMI S1/S2, SEMI E187), medical device manufacturing (ISO 13485), automotive electronics production (IATF 16949, VDA 6.3), aerospace component assembly (AS9100), pharmaceutical cleanroom operations (EU GMP Annex 1), and PCB rework stations requiring continuous EPA-compliant grounding.