Hot air underheater - TEC
OKI
OKI hot-air bottom heaters deliver precisely controlled preheating temperatures from 50 °C to 350 °C with a thermal stability of ±5 °C, protecting PCBs and sensitive SMD components from thermal shock during rework and soldering. Designed for lead-free processes compliant with IEC 61191-1 and RoHS 2011/65/EU, the units generate uniform, laminar hot-air flow across board areas up to 400 x 400 mm, ensuring even heat distribution without cold spots or component displacement.
As an authorized OKI distributor, esd.equipment stocks all 6 current hot-air bottom heater models for immediate dispatch. Each unit ships with calibration documentation and is fully compatible with OKI soldering and rework stations, supporting EPA-compliant ESD-safe workstation integration per IEC 61340-5-1.
OKI Hot-Air Bottom Heater - Product Overview
| Series / Model | Application | Heating Area | Key Feature |
|---|---|---|---|
| OKI HHL-300 | SMD rework, BGA preheating | ca. 300 x 300 mm | Compact footprint, adjustable airflow |
| OKI HHL-400 | Large PCB preheating, lead-free rework | ca. 400 x 400 mm | Extended heating zone, uniform laminar flow |
| OKI HHL-300T | Temperature-profiled preheating | ca. 300 x 300 mm | Programmable thermal profiles, PID control |
| OKI HHL-400T | Production line integration, large boards | ca. 400 x 400 mm | Programmable profiles, ESD-safe housing |
Typical fields of application: Electronics manufacturing and SMD rework (IEC 61191-1, IPC-7711/7721), BGA and QFP component replacement (IPC-A-610), semiconductor and PCB assembly (SEMI S1/S2), medical device production (ISO 13485), automotive electronics rework (IATF 16949, VDA 6.3), aerospace and defense electronics (AS9100), and ESD-protected rework stations (IEC 61340-5-1).