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  1. Weller5
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Did you know? 217 °C

SAC305 is 96.5 percent tin, 3 percent silver and 0.5 percent copper. It melts around 217 degrees Celsius, some 34 degrees above the old eutectic tin lead alloy.

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Soldering tips LT-SMT

Soldering tips

Weller LT-SMT soldering tips are developed specifically for SMD pad cleaning and chip-component soldering and consist of six items for precise rework on surface-mount joints. Wide pad-cleaning tips (SMT01: 10.4 mm; SMT02: 16.8 mm; SMT03: 20.8 mm; T0054446789N: 35 mm) sweep residual solder from the full pad width in one pass. The narrow chip tip SMT04 (width 1.8 mm) addresses individual chip components, while SMT1206D (3.2x1.6 mm / 3.2x2.5 mm) is sized for standard 1206 packages.

ModelFunctionWidth
SMT04Chip tip1.8 mm
SMT1206DChip 1206 standard3.2 x 1.6 mm / 3.2 x 2.5 mm
SMT01PAD cleaning10.4 mm
SMT02PAD cleaning16.8 mm
SMT03PAD cleaning20.8 mm
T0054446789NPAD cleaning35 mm

✓ Single-pass pad cleaning - wide tips SMT01-SMT03 and 35 mm cover the full pad length without repositioning
⚙ Chip tip SMT04 (1.8 mm) - targeted soldering of individual chip resistors and capacitors in high-density arrays
⚡ SMT1206D for standard packages - geometry-matched coverage of 1206 pads, reduces bridging risk at high component density
🛠 LT system compatibility - LT-SMT tips fit all LT-compatible Weller stations

Typical applications: SMD pad preparation after desoldering (rework), pad cleaning prior to component re-placement in SMT production, soldering of 1206 chip components at high placement density, and rework of SMD joints after reflow soldering.

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  1. Soldering tip LT SMT04 for chip, width 1.8 mm, SMT shape - Weller LT SMT04
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    Soldering tip LT SMT04 for chip, width 1.8 mm, SMT shape - Weller LT SMT04
    €90.97
  2. Soldering tip SMT01 for PAD cleaning, width 10.4 mm for WSP 80/WP 80/WXP 120 - Weller SMT01
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    Soldering tip SMT01 for PAD cleaning, width 10.4 mm for WSP 80/WP 80/WXP 120 - Weller SMT01
    €52.98
  3. Soldering tip SMT02 for PAD cleaning, width 16.8 mm for WSP 80/WP 80/WXP 120 - Weller SMT02
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    Soldering tip SMT02 for PAD cleaning, width 16.8 mm for WSP 80/WP 80/WXP 120 - Weller SMT02
    €140.95
  4. Soldering tip SMT03 for PAD cleaning, width 20.8 mm for WSP 80/WP 80/WXP 120 - Weller SMT03
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    Soldering tip SMT03 for PAD cleaning, width 20.8 mm for WSP 80/WP 80/WXP 120 - Weller SMT03
    €140.95
  5. Soldering tip for PAD cleaning, width 35 mm, LT-SMT series - Weller SMT
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    Soldering tip for PAD cleaning, width 35 mm, LT-SMT series - Weller SMT
    €113.96
What are LT-SMT Weller soldering tips and what industrial applications do they serve?
LT-SMT Weller soldering tips are precision-engineered soldering iron tips specifically designed for surface mount technology applications in electronics manufacturing. These specialized tips serve critical functions in electronics assembly lines, semiconductor packaging facilities, and precision repair workshops where components as small as 1.6mm require accurate thermal transfer. The LT-SMT series includes PAD cleaning tips with widths ranging from 10.4mm to 35mm and chip soldering tips as narrow as 1.8mm, enabling technicians to handle everything from large thermal pads to miniature 1206-size components measuring 3.2x1.6mm.
What are the key technical selection criteria for LT-SMT Weller soldering tips?
Selection of LT-SMT Weller soldering tips depends primarily on component size, thermal mass, and soldering operation type. For PAD cleaning operations, tip width selection ranges from SMT01 at 10.4mm for small thermal pads up to 35mm wide tips for large power components, while chip soldering requires precision tips like the SMT04 with 1.8mm width for fine-pitch applications. Component compatibility is critical, with specialized tips like the SMT1206D designed specifically for standard 1206 components measuring 3.2x1.6mm and 3.2x2.5mm. Thermal conductivity and tip geometry must match the solder joint thermal requirements to prevent component damage from overheating or insufficient heat transfer.
What international standards and certifications apply to LT-SMT Weller soldering tips?
LT-SMT Weller soldering tips conform to IPC-J-STD-001 requirements for electronics assembly and IEC 61340-5-1 standards for electrostatic discharge control in electronics manufacturing environments. The tips meet ISO 9001 quality management standards for consistent thermal performance and dimensional accuracy critical in precision soldering applications. ESD-safe variants comply with DIN EN 61340-5-1 requirements, maintaining surface resistivity within the 10^6 to 10^9 ohm range to prevent electrostatic damage to sensitive semiconductor components. Temperature stability and thermal response characteristics align with IPC-2221 guidelines for reliable solder joint formation in high-density electronic assemblies.
What are the differences between SMT PAD cleaning tips and chip soldering tips in the LT-SMT series?
SMT PAD cleaning tips like the SMT01, SMT02, and SMT03 feature wide, flat geometries ranging from 10.4mm to 20.8mm width, designed for efficient thermal pad preparation and large area solder removal on power components and ground planes. Chip soldering tips such as the SMT04 utilize narrow 1.8mm profiles optimized for precision work on small surface mount components without affecting adjacent circuitry. The SMT1206D represents a specialized category with dimensional optimization for standard 1206 package components measuring 3.2x1.6mm and 3.2x2.5mm, providing controlled heat application for consistent solder joint formation. PAD cleaning tips prioritize thermal mass and coverage area, while chip tips emphasize precision placement and minimal heat spread to prevent thermal damage to nearby components.
What are the installation requirements and system compatibility for LT-SMT Weller soldering tips?
LT-SMT Weller soldering tips require compatible Weller soldering stations with LT-series tip holders and temperature control systems capable of maintaining precise thermal regulation within ±5°C tolerance. Installation involves secure mechanical connection to the heating element assembly with proper thermal coupling to ensure accurate temperature transfer from the 24V heating system to the tip working surface. The tips are designed for quick-change compatibility with Weller's professional soldering stations, requiring no tools for replacement while maintaining electrical continuity for temperature sensing feedback. System compatibility extends to ESD-safe workstations meeting IEC 61340-5-1 requirements, with grounding connections established through the soldering iron handle to prevent electrostatic discharge during component handling.
What are the safety ratings and operating parameters for LT-SMT Weller soldering tips?
LT-SMT Weller soldering tips operate safely within temperature ranges from 150°C to 450°C with thermal stability maintained through integrated temperature sensing and PID control systems in compatible Weller stations. ESD-safe variants maintain surface resistivity between 10^6 to 10^9 ohms per DIN EN 61340-5-1 standards, preventing electrostatic discharge damage to sensitive components rated below 100V HBM sensitivity. The tips feature thermal shock resistance suitable for rapid temperature cycling during production environments and maintain dimensional stability across the full operating temperature range. Safety considerations include proper grounding through ESD-compliant workstations and adherence to maximum thermal exposure limits to prevent component damage during soldering operations on temperature-sensitive semiconductors.
What maintenance schedule and service life expectations apply to LT-SMT Weller soldering tips?
LT-SMT Weller soldering tips require daily cleaning with damp sponges and periodic tinning to maintain optimal heat transfer and prevent oxidation buildup that reduces thermal efficiency. Service life typically ranges from 200 to 500 hours of active soldering time, depending on operating temperature, flux chemistry, and cleaning frequency, with PAD cleaning tips generally lasting longer due to their larger thermal mass and reduced mechanical stress. Weekly inspection should verify tip geometry integrity and surface condition, replacing tips when dimensional changes exceed 0.1mm or when thermal response time increases beyond specification. Proper maintenance includes storage in protective caps when not in use and temperature management to avoid thermal cycling stress that can reduce tip longevity and compromise solder joint quality in precision electronics assembly.