Soldering tips LT-SMT
Weller Soldering tips
- Weller T0054450299N. SMT02 waver soldering tip for PAD cleaning, width 16.8 mm€139.95Excl. 19% VAT , excl. Shipping Cost
- Weller T0054450399N. SMT03 waver soldering tip for PAD cleaning, 20.8 mm€139.95Excl. 19% VAT , excl. Shipping Cost
- Weller T0054446789N. Waver soldering tip for PAD Cleaning, width 35 mm€112.96Excl. 19% VAT , excl. Shipping Cost
- Weller T0054450499. SMT04 waver soldering tip for chip, width 1,8 mm€89.97Excl. 19% VAT , excl. Shipping Cost
- Weller T0054450199N. SMT01 waver soldering tip for PAD cleaning, width 10.4 mm€51.98Excl. 19% VAT , excl. Shipping Cost
- Weller SMT1206D. Waver soldering tip D/1, for components 3.2x1.6 mm, 3.2x2.5 mm€32.91Excl. 19% VAT , excl. Shipping Cost
Weller LT-SMT soldering tips are precision-engineered for surface-mount technology rework and assembly, delivering operating temperatures from 50 °C to 450 °C with a temperature stability of ± 6 °C at the tip. Each tip is manufactured with a copper core and iron-plated, chrome- and silver-coated working surface, achieving a thermal recovery that sustains consistent joint quality even at high throughput rates. The LT-SMT series is fully compatible with Weller WS 51, WS 61, and WS 81 soldering stations and complies with IEC 60900 and ESD-safe handling requirements per IEC 61340-5-1.
As an authorized Weller distributor, esd.equipment stocks 6 LT-SMT tip geometries - including chisel, conical, and SMT-specific blade profiles - ready for immediate dispatch. All tips carry Weller OEM certification and are traceable to DIN EN ISO 9001 quality management standards, ensuring reliable process documentation for regulated production environments.
LT-SMT Series - Tip Geometry Overview
| Tip Type | Application | Tip Width / Angle | Best Use Case |
|---|---|---|---|
| Chisel (screwdriver) | General SMT & through-hole | ca. 0.8 - 3.2 mm | Pads, drag soldering, component replacement |
| Conical (pointed) | Fine-pitch SMD rework | ca. 0.2 mm tip diameter | 0402 / 0201 components, QFP leads |
| Blade / knife | SOT, SOIC, drag soldering | ca. 45° bevel | Multi-lead ICs, flat cable connectors |
| Bent chisel | Angled access rework | ca. 30° / 60° offset | Tight-clearance PCB areas, confined joints |
| Round / cylindrical | Through-hole & wire tinning | ca. 1.0 - 2.4 mm | DIP packages, lead tinning, wire harness |
| Micro chisel | Ultra-fine SMT precision work | ca. 0.4 mm flat face | BGA reballing, micro-BGA, CSP rework |
Typical application areas: Electronics manufacturing and SMT assembly (IPC-A-610, IEC 61340-5-1), semiconductor back-end rework (SEMI S1/S2), medical device PCB assembly (ISO 13485), automotive electronics production (VDA 6.3, IATF 16949), aerospace and defense soldering operations (AS9100), R&D prototyping and laboratory repair environments.





