Soldering robot Quick - ESD (antistatic)
Quick Soldering tools
Quick soldering robots deliver fully automated, flux-activated joint formation with positioning repeatability of ±0.02 mm and tip temperatures controlled to ±2 °C across a soldering range of 200-450 °C - meeting the joint-quality requirements of IPC-A-610 Class 2 and Class 3. Integrated vision systems and programmable XYZ-theta axes allow multi-point programs on PCB assemblies with component pitches down to 0.5 mm, eliminating hand-soldering variation in high-mix production.
As an authorised Quick distributor, esd.equipment stocks 14 Quick soldering robot models - spanning benchtop selective units through full gantry platforms - all certified to IEC 61000 (EMC) and CE-marked for European industrial deployment. Quick's proprietary iron-tip management logs contact force, dwell time, and temperature in real time, providing full process traceability in line with IPC-7711/7721 rework documentation requirements.
Quick Soldering Robot - Product overview
| Series / Model type | Application | Key specification | Distinguishing feature |
|---|---|---|---|
| Benchtop selective robot | SMT rework, through-hole selective | Work area ca. 300 x 250 mm, ±0.02 mm repeat | Compact footprint, rapid program changeover |
| Inline gantry robot | High-volume PCB assembly lines | Work area ca. 500 x 450 mm, conveyor integration | SMEMA-compatible for automated board transport |
| Multi-head soldering robot | Dual-side or simultaneous multi-joint soldering | Up to 2 independent iron heads, 200-450 °C each | Cycle-time reduction vs. single-head systems ca. 40% |
| Laser soldering robot | Heat-sensitive substrates, fine-pitch connectors | Spot diameter ca. 0.3 mm, non-contact process | Zero mechanical stress, IPC-A-610 Class 3 quality |
Typical application areas: PCB selective soldering in SMT electronics manufacturing (IPC-A-610 Class 2/3, IPC-7711/7721), automotive electronics and ECU assembly (IATF 16949, VDA 6.3), medical device PCB production (ISO 13485), semiconductor module assembly (SEMI S1/S2), aerospace and defence avionics wiring (AS9100D), high-mix low-volume contract electronics manufacturing (IEC 61000 EMC compliance).