Grab Containers Bosch Rexroth - TEC
Assembly Technology Bosch Rexroth
Bosch Rexroth Greifbehälter (grip containers) are engineered for lean assembly workstations and flow-rack systems, delivering precise parts presentation with standardised bin dimensions compatible with TS 2plus and TS 5 transfer systems. Tote dimensions follow the European small-load carrier grid (300 x 200 mm and 400 x 300 mm base footprints), with wall thickness tolerances held to <0.5 mm for reliable stacking and chuting. Load capacities range from 5 kg to 25 kg per bin, and the polypropylene body meets the mechanical requirements of VDI 3596 for ergonomic parts feeding.
As an authorised distributor for Bosch Rexroth assembly technology, esd.equipment stocks 63 Greifbehälter variants - including smooth-front, open-front, and sloped-front designs - ready for immediate dispatch. All containers integrate directly into Bosch Rexroth flow-rack and kanban systems and comply with DIN EN ISO 9001-certified supply-chain requirements for traceability in automotive and electronics manufacturing.
Bosch Rexroth Greifbehälter - Product overview
| Type | Application | Base dimension | Max. load | Key feature |
|---|---|---|---|---|
| Smooth-front bin | Flow rack, kanban shelf | 300 x 200 mm | 10 kg | Label window, stackable |
| Open-front bin | Assembly workstation picking | 400 x 300 mm | 25 kg | Full-width opening, ribbed base |
| Sloped-front bin | Ergonomic lean workstation | 300 x 200 mm | 10 kg | Angled front, VDI 3596 ergonomics |
| Deep-body bin | Bulk small-parts storage | 400 x 300 mm | 25 kg | Increased height, nestable |
| Divider-compatible bin | Multi-SKU sorting & sequencing | 300 x 200 mm | 5 kg | Accepts standard Rexroth inserts |
| TS system carrier | TS 2plus / TS 5 conveyor integration | 400 x 300 mm | ca. 20 kg | Anti-slip base, transfer-line proven |
Typical applications: Electronics assembly and SMT line feeding (IPC-A-610, IEC 61340-5-1), automotive body-in-white and powertrain assembly (VDA 6.3, IATF 16949), medical device manufacturing (ISO 13485), semiconductor back-end packaging (SEMI S2), lean manufacturing and kanban replenishment systems (VDI 3596), aerospace sub-assembly kitting (AS9100).