JBC Soldering tips C210

JBC Soldering tips

JBC C210 soldering tips are engineered exclusively for the T210-A and T210-NA handles, featuring a precision-matched 1.0 mm barrel diameter and tip masses starting below 0.5 g - enabling thermal recovery times under 1.5 seconds at 350 °C operating temperature. The cartridge-style design integrates heater and thermocouple directly into the tip body, delivering temperature accuracy of ±2 °C and idle-mode stability that prevents oxidation during standby. With a working range of 50-450 °C, the C210 series covers fine-pitch SMD rework down to 0201 components as well as through-hole work on connectors and wire joints.

esd.equipment stocks 33 C210 tip geometries - conical, chisel, bevel, knife, and micro variants - all certified to IEC 61010-1 and compatible with JBC's Sleep and Hibernation technology per IPC J-STD-001. Each cartridge is RoHS-compliant and lead-free solder ready, with a reinforced iron-clad copper core for extended service life beyond 5,000 operating hours under normal production conditions.

Key technical advantages - JBC C210 Soldering Tips at a glance
Recovery < 1.5 s at 350 °C - integrated heater+thermocouple cartridge design
50-450 °C working range - covers SMD rework to heavy through-hole joints
🛠 Tip mass < 0.5 g - ultra-low thermal mass for fine-pitch 0201 component work
33 geometries in stock - conical, chisel, bevel, knife, micro, and hoof variants
🔍 ±2 °C temperature accuracy - direct thermocouple at tip, IEC 61010-1 certified
RoHS & IPC J-STD-001 - lead-free solder ready, Sleep/Hibernation compatible

JBC C210 Tip Series - Product Overview

Tip Type Geometry Tip Width / Size Typical Application
C210-001 Conical sharp 0.2 mm Fine-pitch SMD, 0201 components
C210-002 Conical 0.5 mm General SMD, IC leads
C210-018 Chisel 1.5 mm Through-hole, drag soldering
C210-020 Chisel 3.0 mm Heavy through-hole, connectors
C210-006 Bevel 45°, 1.2 mm QFP, flat-pack chip rework
C210-032 Knife 1.0 mm blade Cutting flux bridges, SOIC leads
C210-040 Hoof / Micro 0.8 mm BGA pad prep, micro-rework
C210-048 Bent conical 30°, 0.3 mm Restricted access, upright boards

Typical application areas: Electronics manufacturing and SMT assembly (IPC J-STD-001, IPC-A-610), semiconductor and wafer-level packaging (SEMI S1/S2), medical device PCB assembly (ISO 13485), automotive electronics and ECU rework (IATF 16949, VDA 6.3), aerospace and defense board repair (AS9100), and precision R&D laboratory prototyping (IEC 61010-1).

33 C210 Tips in Stock All geometries - conical, chisel, bevel, knife, hoof - ready to ship
📦
T210-A & T210-NA Compatible Guaranteed fit for JBC T210-A and T210-NA soldering handles
🛡
IEC 61010-1 Certified RoHS-compliant, IPC J-STD-001 ready, lead-free solder compatible
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