Soldering tips S

The Thermaltronics Spitzenserie S delivers soldering tip performance engineered for high-reliability rework and production soldering, with tip-to-ground resistance consistently below 2 Ω and thermal recovery rated to sustain continuous throughput at set-point temperatures from 50 °C to 450 °C. The series uses a copper core bonded under a multi-layer iron-chrome plating system, achieving a thermal mass optimised for fine-pitch SMD work down to 0201 components and QFP leads at 0.4 mm pitch. All tips in the S series are designed for direct compatibility with Thermaltronics TMT-9000S and TMT-2000S stations, with tip-change interlock times under 2 seconds cold-to-operating temperature.

esd.equipment stocks 127 individual Spitzenserie S tip configurations - covering conical, chisel, knife, bevel, and micro-wave geometries - sourced direct from Thermaltronics and verified for compliance with IEC 61191-1 soldering process requirements and IPC J-STD-001 Class 3 workmanship standards. Every tip ships with full lot traceability documentation, making this catalogue the reference source for authorised Thermaltronics consumable procurement across European production and repair facilities.

Thermaltronics Spitzenserie S - Product overview

Typical application areas: Electronics manufacturing SMT assembly (IPC J-STD-001 Class 2/3, IEC 61191-1), semiconductor package-level rework and reballing (SEMI S1/S2), medical device PCB assembly and repair (ISO 13485), automotive electronics production (IATF 16949, VDA 6.3), aerospace avionics rework (AS9100), and ESD-protected repair bench operations (IEC 61340-5-1, IEC 61340-5-2).