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Hot Air Nozzle BGA 20×20mm - Hakko N51-19
Specialized BGA hot air nozzle with 20×20mm opening for the Hakko FR-810 and FR-810B hot air rework stations. Designed for precise heating of ball grid array components during soldering and desoldering operations.
- Specialist dealer since 2009
- Invoice payment for regular customers
- Worldwide shipping
- Technical questions clarified with the manufacturer
Description
Overview
The Hakko N51-19 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) component rework. With a 20×20mm opening, this nozzle delivers focused, uniform heat distribution ideal for soldering and desoldering fine-pitch ball grid array packages on PCBs.
Key Features
- BGA-optimized nozzle design with 20×20mm opening
- Compatible with FR-810 and FR-810B hot air rework stations
- Precision heat concentration for controlled thermal profiles
- Durable construction for repeated rework cycles
- Easy installation and removal
Applications
Ideal for rework and repair of BGA components on circuit boards, including microprocessors, memory modules, and other fine-pitch ball grid array packages in electronics manufacturing and repair facilities.
Technical data
| Nozzle Type | BGA Hot Air Nozzle |
|---|---|
| Opening Size | 20×20mm |
| Compatible Stations | Hakko FR-810, FR-810B |
| Country of Origin | Japan |
| Weight | 0.01 kg |
| Manufacturer | Hakko |
| Manufacturer Nr. | N51-19 |
| EAN | 4962615047534 |
| Note | Es gibt keine Lieferung von Hakko Produkten in die Schweiz |
| HS-Code | 85159080 |
| GPSR manufacturer information | TBK - Technisches Büro Kullik GmbH Industriestrasse 27 DE-56276 Großmaischeid www.kullik.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Japan |
| ESD version | TEC |
Downloads
Datasheet
Catalogue
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