Hot Air Nozzle BGA 20×20mm - Hakko N51-19

€93.10
Excl. 19% VAT , excl. Shipping Cost
Article
HK-N51-19

Manufacturer Nr.
N51-19
Specialized BGA hot air nozzle with 20×20mm opening for the Hakko FR-810 and FR-810B hot air rework stations. Designed for precise heating of ball grid array components during soldering and desoldering operations.
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Overview

The Hakko N51-19 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) component rework. With a 20×20mm opening, this nozzle delivers focused, uniform heat distribution ideal for soldering and desoldering fine-pitch ball grid array packages on PCBs.

Key Features

  • BGA-optimized nozzle design with 20×20mm opening
  • Compatible with FR-810 and FR-810B hot air rework stations
  • Precision heat concentration for controlled thermal profiles
  • Durable construction for repeated rework cycles
  • Easy installation and removal

Technical Specifications

Nozzle TypeBGA Hot Air Nozzle
Opening Size20×20mm
Compatible StationsHakko FR-810, FR-810B
Country of OriginJapan

Applications

Ideal for rework and repair of BGA components on circuit boards, including microprocessors, memory modules, and other fine-pitch ball grid array packages in electronics manufacturing and repair facilities.

More Information
Execution TEC
Manufacturer Nr. N51-19
Manufacturer Hakko
Country of Manufacture Japan
EAN 4962615047534
Weight 0.009900
Note Es gibt keine Lieferung von Hakko Produkten in die Schweiz
HS-Code 85159080
GPSR manufacturer information TBK - Technisches Büro Kullik GmbH Industriestrasse 27 DE-56276 Großmaischeid www.kullik.com
Article authenticity Original product
Condition of article New
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