Hot Air Nozzle BGA 20×20mm - Hakko N51-19

Overview

The Hakko N51-19 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) component rework. With a 20×20mm opening, this nozzle delivers focused, uniform heat distribution ideal for soldering and desoldering fine-pitch ball grid array packages on PCBs.

Key Features

• BGA-optimized nozzle design with 20×20mm opening
• Compatible with FR-810 and FR-810B hot air rework stations
• Precision heat concentration for controlled thermal profiles
• Durable construction for repeated rework cycles
• Easy installation and removal

Technical Specifications

Applications

Ideal for rework and repair of BGA components on circuit boards, including microprocessors, memory modules, and other fine-pitch ball grid array packages in electronics manufacturing and repair facilities.