Hot Air Nozzle BGA 17×17mm - Hakko N51-17

Overview

The Hakko N51-17 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) component rework. With a 17×17mm opening, it delivers concentrated, uniform heat distribution ideal for soldering and desoldering BGA packages on PCBs. Compatible with Hakko FR-810 and FR-810B hot air rework stations.

Key Features

• 17×17mm BGA-specific opening for targeted heating
• Optimized air flow pattern for uniform temperature distribution
• Direct compatibility with FR-810 and FR-810B stations
• Durable construction for repeated rework cycles
• Precision engineering for professional-grade results

Technical Specifications

Applications

Ideal for rework and repair of BGA components in electronics manufacturing, PCB assembly, and field service environments. Suitable for lead-free and lead-based solder applications.