N51 Series
Soldering and Desoldering Tips
The Hakko N51 Series are hot-air nozzles for BGA rework and general hot-air applications. The programme covers square BGA nozzles from 4x4 mm (N51-10) to 40x40 mm (N51-26), as well as round single-purpose nozzles in diameters of 2.5 mm, 3 mm (45° angled), 4 mm, 5.5 mm, and 7 mm. The N51-50 set combines the 2.5, 5.5, and 7.0 mm diameters in a single pack. The square BGA nozzles direct hot air precisely over the BGA array without thermally stressing adjacent components.
| Model | BGA size | Model | BGA size |
|---|---|---|---|
| N51-10 | 4x4 mm | N51-19 | 20x20 mm |
| N51-11 | 6x6 mm | N51-20 | 22x22 mm |
| N51-12 | 8x8 mm | N51-21 | 24x24 mm |
| N51-13 | 10x10 mm | N51-22 | 27x27 mm |
| N51-14 | 12x12 mm | N51-23 | 29x29 mm |
| N51-15 | 14x14 mm | N51-24 | 35x35 mm |
| N51-16 | 15x15 mm | N51-25 | 38x38 mm |
| N51-17 | 17x17 mm | N51-26 | 40x40 mm |
| N51-18 | 18x18 mm | - | - |
Typical applications: BGA rework and reballing on processors, FPGAs and memory BGAs from 4x4 to 40x40 mm, heat-shrinking of tubing and thermal pads with round nozzles, removal of potting compounds and adhesives on assemblies, and general hot-air work in repair and prototype production.
