Hot Air Nozzle BGA 18×18mm - Hakko N51-18

Overview

The Hakko N51-18 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) component rework. With an 18×18mm opening, this nozzle provides focused, uniform heat distribution for soldering and desoldering BGA packages on PCBs. Compatible with Hakko FR-810 and FR-810B hot air rework stations.

Key Features

• 18×18mm square opening optimized for BGA components
• Uniform heat distribution for consistent solder reflow
• Compatible with FR-810 and FR-810B hot air stations
• Precision-engineered for professional rework applications
• Durable construction for repeated use

Technical Specifications

Applications

Ideal for rework and repair of BGA components on circuit boards. Provides precise thermal control for lead-free and traditional solder applications in electronics manufacturing and repair facilities.