Hakko T20 Series
Hakko Soldering and Desoldering Tips
The Hakko T20 Series comprises precision soldering tips engineered for the Hakko FX-838 soldering station, delivering tip temperatures stable to within ±2 °C under continuous load. T20 tips feature a composite copper-iron core with micro-plating to achieve thermal recovery rates comparable to higher-wattage systems, while maintaining a working temperature range of 200-450 °C. Tip resistance is held to <2 Ω contact-to-ground, ensuring ESD-safe operation in compliance with IEC 61340-5-1 EPA requirements.
As an authorised Hakko distributor, esd.equipment stocks all 22 T20 tip variants - including conical, chisel, bevel, knife and micro-conical geometries - ready for immediate dispatch. Every tip ships with Hakko factory certification and is fully compatible with the FX-838 quick-change barrel system, eliminating tool-down time during tip changes on the production floor.
Hakko T20 Series - Tip Geometry Overview
| Tip Type | Typical Application | Tip Width / Angle | Best For |
|---|---|---|---|
| Conical (T20-B) | General-purpose through-hole & SMD | 0.5 mm point | Fine pitch, precision work |
| Chisel (T20-D) | High-volume through-hole soldering | 2.0 / 3.0 / 4.0 mm | Connectors, leads, pads |
| Bevel (T20-BC) | SMD rework, drag soldering | 45° bevel, 3.0 mm | SOIC, QFP drag soldering |
| Knife (T20-KF) | Cutting wire insulation, bridging | Blade profile | Wire work, solder bridge removal |
| Micro-conical (T20-I) | Ultra-fine pitch SMD, 0201 components | 0.2 mm point | Micro-electronics, wearables |
| Hoof (T20-CF) | SMD chip component placement | Curved, 1.0 mm | Chip resistors, capacitors |
Typical application areas: Electronics manufacturing and SMT assembly lines (IPC-A-610, IEC 61340-5-1), semiconductor back-end assembly (SEMI S1/S2), medical device PCB manufacturing (ISO 13485), automotive electronics production (IATF 16949), aerospace and defence avionics rework (AS9100D), R&D laboratory prototyping, and ESD-protected repair workstations in professional service environments.