Inspection Systems - TEC

Inspection systems for soldering technology deliver non-destructive, high-resolution quality control at every stage of PCB assembly - from paste deposition through reflow to final solder joint verification. Automated Optical Inspection (AOI) systems detect defects at <50 µm resolution, while X-ray inspection (AXI) examines hidden solder joints under BGA, QFN, and LGA packages to IPC-A-610 Class 2 and Class 3 acceptance criteria. Solder paste inspection (SPI) systems measure deposit volume, area, and height with ±1 µm repeatability, preventing up to 70% of downstream assembly defects before they reach the reflow oven.

Our portfolio of 12 inspection systems covers inline and offline configurations for laboratories, prototyping lines, and full-volume SMT production. All systems comply with IPC-7711/7721, IEC 61191, and DIN EN ISO 9001 quality management requirements, ensuring traceable, documented results for electronics manufacturing in regulated industries.

Typical application areas: SMT electronics assembly (IPC-A-610 Class 2/3, IEC 61191), PCB prototype inspection (IPC-7711/7721), semiconductor packaging verification (SEMI G69), medical device manufacturing (ISO 13485), automotive electronics (IATF 16949, VDA 6.3), aerospace and defense PCB qualification (AS9100D, MIL-PRF-31032)