Soldering and desoldering tips
Soldering tips M
The Thermaltronics M series contains desoldering tips and soldering tweezer pairs for the TMT-9000S station. Desoldering tips (M60DT) are available with inner bore diameters of 0.80 mm (M60DT003), 1.10 mm (M60DT004), 1.35 mm (M60DT005), 1.50 mm (M60DT006) and 2.40 mm (M60DT007), with long-reach variants (L suffix) for deep through-hole pads. Tweezer pairs (M60TZ) range from 0.25 mm Micro Fine through chisel and conical forms up to blade pairs (15.75 mm and 22.10 mm). The series also includes soldering tips (M6B, M6BS) for bevelled and angled applications, including Power Plus variants (H suffix).
- 288 items
- 1 manufacturer
- Net prices plus VAT
Buying guide
How to choose Soldering tips M
What matters when choosing: properties, comparison and typical applications.
M series product shapes
Desoldering tip selection by bore diameter
| Model | Inner bore | Reach | Typical use |
|---|---|---|---|
| M60DT003 / M60DT003L | 0.80 mm | Standard / Long | 0.8 mm pads, fine THT |
| M60DT004 / M60DT004L | 1.10 mm | Standard / Long | Standard THT components |
| M60DT005 / M60DT005L | 1.35 mm | Standard / Long | Larger through-hole bores |
| M60DT006 | 1.50 mm | Standard | Relays, connectors |
| M60DT007 | 2.40 mm | Standard | Power components, screw terminals |
Typical applications
Typical applications: Desoldering of THT components across bore sizes 0.8-2.4 mm at the TMT-9000S station, SMD chip rework (0201, 0402, 0805) with Micro Fine tweezer pairs, SOIC rework with blade pairs, multilayer boards with long-reach desoldering tips, and repair or field service on populated assemblies.