Did you know? 217 °C

SAC305 is 96.5 percent tin, 3 percent silver and 0.5 percent copper. It melts around 217 degrees Celsius, some 34 degrees above the old eutectic tin lead alloy.

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Soldering tips M

Soldering and desoldering tips

The Thermaltronics M series contains desoldering tips and soldering tweezer pairs for the TMT-9000S station. Desoldering tips (M60DT) are available with inner bore diameters of 0.80 mm (M60DT003), 1.10 mm (M60DT004), 1.35 mm (M60DT005), 1.50 mm (M60DT006) and 2.40 mm (M60DT007), with long-reach variants (L suffix) for deep through-hole pads. Tweezer pairs (M60TZ) range from 0.25 mm Micro Fine through chisel and conical forms up to blade pairs (15.75 mm and 22.10 mm). The series also includes soldering tips (M6B, M6BS) for bevelled and angled applications, including Power Plus variants (H suffix).

⚙ Desoldering M60DT (standard) - inner bore 0.80 / 1.10 / 1.35 / 1.50 / 2.40 mm

⚙ Desoldering M60DT (long reach) - L suffix, for deep holes and multilayer boards

✓ Tweezer pairs M60TZ Micro Fine - 0.25 mm, for 0201 chips and QFN rework

✓ Tweezer pairs M60TZ conical/chisel - 0.4-1.78 mm, SMD chip rework with bilateral heating

✓ Tweezer pairs M60TZ blade - 15.75 mm and 22.10 mm, for SOIC and flat packages

⚙ Soldering tips M6B (bevelled) - 0.7-3 mm, Power Plus variants (H suffix)

Model	Inner bore	Reach	Typical use
M60DT003 / M60DT003L	0.80 mm	Standard / Long	0.8 mm pads, fine THT
M60DT004 / M60DT004L	1.10 mm	Standard / Long	Standard THT components
M60DT005 / M60DT005L	1.35 mm	Standard / Long	Larger through-hole bores
M60DT006	1.50 mm	Standard	Relays, connectors
M60DT007	2.40 mm	Standard	Power components, screw terminals

Typical applications: Desoldering of THT components across bore sizes 0.8-2.4 mm at the TMT-9000S station, SMD chip rework (0201, 0402, 0805) with Micro Fine tweezer pairs, SOIC rework with blade pairs, multilayer boards with long-reach desoldering tips, and repair or field service on populated assemblies.