Soldering tips M

Soldering and desoldering tips

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The Thermaltronics Spitzenserie M delivers precision soldering tips engineered for the Thermaltronics TMT-9000S and compatible stations, featuring Curie-point thermal regulation that holds tip temperatures within ±2 °C of setpoint across a working range of 50-450 °C. The proprietary iron-nickel alloy core activates magnetic self-regulation directly at the tip, eliminating overshoot and reducing thermal stress on sensitive SMD components rated down to 0402 package sizes. Tip-to-ground resistance is maintained at <2 Ω in accordance with IEC 61340-5-1, making every tip in this series fully EPA-compatible for electrostatic-sensitive assemblies.

As an authorised distributor, esd.equipment stocks over 300 Spitzenserie M tip variants - covering chisel, conical, bevel, and specialty profiles - all conforming to DIN EN ISO 9454 flux compatibility requirements and IPC J-STD-001 process standards. From fine-pitch rework on PCB assemblies to high-thermal-mass connector soldering, the M series provides the geometry and alloy consistency demanded by electronics manufacturing, aerospace, and medical device production environments.

Key technical advantages - Spitzenserie M at a glance
±2 °C temperature stability - Curie-point self-regulation, 50-450 °C range
🔍 Tip-to-ground <2 Ω - IEC 61340-5-1 compliant, full EPA protection
🛠 300+ tip geometries - chisel, conical, bevel, and specialty profiles in stock
TMT-9000S compatible - direct fit, no adapters, instant tool-free tip swap
🛡 IPC J-STD-001 rated - verified flux and alloy compatibility for Class 2/3 assemblies
Lead-free alloy plating - RoHS 2011/65/EU compliant, DIN EN ISO 9454 compatible flux

Spitzenserie M - Product overview

Tip Profile Typical Application Tip Width / Angle Key Advantage
Chisel (flat) Through-hole and drag soldering, pads 1.0-6.5 mm High thermal mass transfer, fast heat-up
Conical (pointed) Fine-pitch SMD, 0402/0201 components 0.2-0.8 mm Precision placement, minimal pad bridging
Bevel (angled) QFP, SOIC, drag soldering on fine-pitch IC 30°/45°, 1.5-3.5 mm Controlled solder flow, reduced bridges
Knife / blade Cutting flux, rework, lead-trimming ca. 1.0 mm blade Dual-function: solder and trim in one step
Hoof / bent BGA pad repair, connector pins, coax 1.2-2.5 mm, 60° bend Access to recessed joints, large heat reserve
Mini wave Drag soldering row connectors, SOP packages ca. 3.0-4.0 mm well Solder reservoir minimises reapplication

Typical application areas: Electronics manufacturing and SMT assembly (IPC J-STD-001, IPC-A-610), semiconductor and wafer-level packaging (SEMI S1/S2), medical device PCB assembly (ISO 13485), automotive electronics and ECU production (IATF 16949, VDA 6.3), aerospace and defence rework (AS9100), R&D prototyping and laboratory soldering (IEC 61340-5-1 EPA environments)

300+ M-Series Tips in Stock All geometries - chisel, conical, bevel, hoof, knife, mini wave
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Authorised Thermaltronics Distributor Genuine M-series tips, OEM-verified compatibility with TMT-9000S
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IEC 61340-5-1 & IPC J-STD-001 EPA-safe tip-to-ground <2 Ω, RoHS 2011/65/EU compliant plating