Soldering tips M
Soldering and desoldering tips
The Thermaltronics Spitzenserie M delivers precision soldering tips engineered for the Thermaltronics TMT-9000S and compatible stations, featuring Curie-point thermal regulation that holds tip temperatures within ±2 °C of setpoint across a working range of 50-450 °C. The proprietary iron-nickel alloy core activates magnetic self-regulation directly at the tip, eliminating overshoot and reducing thermal stress on sensitive SMD components rated down to 0402 package sizes. Tip-to-ground resistance is maintained at <2 Ω in accordance with IEC 61340-5-1, making every tip in this series fully EPA-compatible for electrostatic-sensitive assemblies.
As an authorised distributor, esd.equipment stocks over 300 Spitzenserie M tip variants - covering chisel, conical, bevel, and specialty profiles - all conforming to DIN EN ISO 9454 flux compatibility requirements and IPC J-STD-001 process standards. From fine-pitch rework on PCB assemblies to high-thermal-mass connector soldering, the M series provides the geometry and alloy consistency demanded by electronics manufacturing, aerospace, and medical device production environments.
Spitzenserie M - Product overview
| Tip Profile | Typical Application | Tip Width / Angle | Key Advantage |
|---|---|---|---|
| Chisel (flat) | Through-hole and drag soldering, pads | 1.0-6.5 mm | High thermal mass transfer, fast heat-up |
| Conical (pointed) | Fine-pitch SMD, 0402/0201 components | 0.2-0.8 mm | Precision placement, minimal pad bridging |
| Bevel (angled) | QFP, SOIC, drag soldering on fine-pitch IC | 30°/45°, 1.5-3.5 mm | Controlled solder flow, reduced bridges |
| Knife / blade | Cutting flux, rework, lead-trimming | ca. 1.0 mm blade | Dual-function: solder and trim in one step |
| Hoof / bent | BGA pad repair, connector pins, coax | 1.2-2.5 mm, 60° bend | Access to recessed joints, large heat reserve |
| Mini wave | Drag soldering row connectors, SOP packages | ca. 3.0-4.0 mm well | Solder reservoir minimises reapplication |
Typical application areas: Electronics manufacturing and SMT assembly (IPC J-STD-001, IPC-A-610), semiconductor and wafer-level packaging (SEMI S1/S2), medical device PCB assembly (ISO 13485), automotive electronics and ECU production (IATF 16949, VDA 6.3), aerospace and defence rework (AS9100), R&D prototyping and laboratory soldering (IEC 61340-5-1 EPA environments)