Ableitfähig - dissipative
ESD Beutel
Dissipative ESD bags combine a surface resistance of 10⁵ to 10⁷ Ω (per IEC 61340-5-1) with controlled charge decay, making them the preferred choice wherever conductive packaging would create short-circuit risk on populated PCBs and sensitive sub-assemblies. The dissipative layer bleeds static energy gradually - verified decay time < 2 s at 1,000 V per IEC 61340-4-1 - while the translucent film allows visual part identification without opening the bag.
This listing brings together 35 dissipative ESD bag variants from leading ESD packaging specialists, all selected for compliance with IEC 61340-5-1 and ESD S20.20 requirements. Formats range from small component pouches to large-format bags for board-level assemblies, covering resealable zip-lock, heat-sealable, and permanent-seal constructions for storage, transit, and in-process handling within EPA-controlled environments.
Dissipative vs. Conductive vs. Shielding ESD Bags - technical comparison
| Criterion | Dissipative | Conductive | Metal-In Shielding |
|---|---|---|---|
| Surface resistance | 10⁵-10⁷ Ω | < 10⁵ Ω | 10⁵-10¹¹ Ω (outer layer) |
| Short-circuit risk on PCBs | None - safe for populated boards | High - may short exposed leads | Low - inner layer typically dissipative |
| Charge decay (1,000 V) | < 2 s per IEC 61340-4-1 | < 0.1 s (rapid) | < 2 s (dissipative inner) |
| Electrostatic shielding (ESD S11.31) | Not applicable - no metal layer | Not applicable | < 50 nJ per ESD S11.31 |
| Transparency / visual inspection | Translucent - contents visible | Often opaque (black poly) | Semi-transparent (metalized film) |
| Typical application | In-process EPA handling, WIP storage | Bulk component trays, foam liners | Transport outside EPA, finished goods |
| Standard compliance | IEC 61340-5-1, ESD S20.20 | IEC 61340-5-1 | ESD S11.31, IEC 61340-5-1 |
Typical applications: Electronics manufacturing and SMT assembly lines (IEC 61340-5-1, IPC-A-610), semiconductor component handling and wafer-level packaging (SEMI S1/S2), medical device production requiring ESD-safe in-process packaging (ISO 13485), automotive electronics and ECU assembly (IATF 16949, VDA 6.3), aerospace avionics sub-assembly storage and kitting (AS9100), and laboratory environments with EPA-controlled workstations requiring compliant WIP bag solutions (ESD S20.20).