Foils - ESD (antistatic)
ESD Packaging
ESD protective films deliver surface resistivity in the range of 10⁵ - 10⁹ Ω per IEC 61340-5-1, forming the first physical barrier against electrostatic discharge events that exceed 100 V HBM - the threshold at which unprotected CMOS and MOSFET components sustain latent damage. Available in low-density polyethylene (LDPE), polypropylene (PP), and multilayer co-extruded constructions, film thicknesses span 50 - 200 µm, with shielding variants achieving <10 nJ discharge energy per IEC 61340-5-3 for MSD Level 1-6 handling.
As a specialist distributor for EPA-compliant packaging consumables, esd.equipment stocks 56 ESD film references - covering static-dissipative PE sheeting, metallized shielding film, VCI combination films, and anti-static stretch wrap - all traceable to DIN EN 61340-5-1 and ANSI/ESD S541 packaging standards. Brands include Desco, Bondline, and Vermason, with stock available for same-week dispatch across Europe.
ESD Film types - technical comparison
| Criterion | Metallized Shielding Film | Static-Dissipative PE Film | VCI Combination Film | Anti-Static Stretch Wrap |
|---|---|---|---|---|
| Surface resistivity | <10¹² Ω (shielding layer) | 10⁶ - 10⁹ Ω | 10⁶ - 10⁷ Ω | 10⁶ - 10¹² Ω |
| Discharge energy | <10 nJ per IEC 61340-5-3 | Not rated | Not rated | Not rated |
| Primary standard | IEC 61340-5-1 & S541 | IEC 61340-5-1 | IEC 61340-5-1 / DIN 55473 | ANSI/ESD S541 |
| Typical thickness | 75 - 100 µm | 50 - 150 µm | 80 - 200 µm | 17 - 25 µm |
| Corrosion protection | No (use VCI for metals) | No | Yes - VCI inhibitors included | No |
| Best suited for | PCBA, IC, MSD Level 1-6 | General ESD packaging, kitting | Mixed metal + electronic assemblies | Pallet wrapping, tote lining |
| Sealable / heat-weldable | Yes - impulse bar sealer | Yes | Yes | No (self-cling only) |
| Transparency | Semi-transparent (silver) | Clear or pink-tinted | Clear or blue-tinted | Clear or blue-tinted |
Typical application areas: Electronics manufacturing and SMT line packaging (IPC-A-610, IEC 61340-5-1), semiconductor wafer and die transport (SEMI S1/S2, JESD22), medical device sub-assembly kitting (ISO 13485, IEC 61340-5-1), automotive electronics and ECU supply chain packaging (IATF 16949, VDA 6.3), aerospace avionics board protection (AS9100, ANSI/ESD S541), and contract electronics manufacturing WIP traceability wrapping.