Hakko T31 Series
Hakko Soldering and Desoldering Tips
The Hakko T31 Series comprises precision soldering tips engineered exclusively for the Hakko FX-100 induction-heated soldering station, delivering tip-temperature stability of ±2 °C under continuous load - a critical requirement in lead-free soldering processes governed by IEC 61191-1 and J-STD-001. Unlike resistive heating elements, the T31 system uses high-frequency induction to heat the tip directly at the working point, achieving thermal recovery in under 1.5 seconds from 300 °C to 350 °C at a continuous draw of 80 W. Tip-surface resistance is maintained at <1 Ω to ensure full electrostatic compatibility with EPA workplaces per IEC 61340-5-1, with a ground-path resistance of <1 Ω tip-to-ground throughout the tip lifetime.
As an authorized Hakko distributor, esd.equipment stocks 45 T31 Series tip variants - covering conical, chisel, bevel, knife, and micro-point geometries from 0.2 mm to 6.0 mm working diameter - all RoHS-compliant and traceable to DIN EN ISO 9001-certified manufacturing. Every tip ships with the Hakko material certificate confirming copper-core construction, iron plating, and nickel barrier layer conforming to Hakko internal standard T31-SPEC-2022.
Hakko T31 Series - Product overview
| Tip type | Working diameter / size | Typical application | Key feature |
|---|---|---|---|
| Conical (C-type) | 0.2 mm - 1.0 mm | Fine-pitch SMD, 0201 components | Precision point, minimal solder bridging |
| Chisel (D-type) | 1.0 mm - 4.0 mm | Through-hole, drag soldering, connectors | High thermal mass, fast joint wetting |
| Bevel (B-type) | 2.0 mm - 6.0 mm | Pad soldering, ground planes, large joints | Angled face maximizes contact area |
| Knife (K-type) | ca. 3.0 mm blade | IC lead trimming, drag, desoldering prep | Dual working edge, reduced bridging risk |
| Micro-point (I-type) | 0.2 mm - 0.5 mm | BGA rework, micro-coax, ultra-fine SMD | Needle geometry, <0.3 mm tip radius |
Typical application areas: PCB assembly and SMT production (IPC-A-610, J-STD-001), semiconductor package rework (SEMI E10), medical device electronics manufacturing (IEC 60601-1, ISO 13485), automotive control unit soldering (IATF 16949, VDA 6.3), aerospace and defense PCB repair (IPC-7711/7721, AS9100), and ESD-sensitive component handling in controlled EPA environments (IEC 61340-5-1).