JBC Soldering tips for soldering irons - ESD (antistatic)
JBC Soldering tips
JBC soldering tips for mixed soldering and desoldering irons are precision-engineered from high-purity copper alloy cores with iron-coated and chrome-plated working faces, delivering thermal recovery times under 0.5 s and tip temperatures stable to within ±2 °C - measured at the point of contact. The patented JBC Sleep & Hibernate system reduces tip operating temperature to 180 °C during idle phases, extending active tip lifespan by up to 5x compared to conventional fixed-temperature stations. Compatibility spans the full JBC cartridge and classic tip range, including C210, C245, C115, C120, C130, and specialty desoldering series, with working temperatures from 90 °C to 450 °C and tip diameters from 0.1 mm micro-conical to 12 mm chisel geometries - all compliant with IEC 61340-5-1 for ESD-safe use.
This catalog covers 39 JBC soldering tips for diverse soldering and desoldering irons, curated for professional electronics manufacturing, rework, and repair environments. Each tip ships in original JBC packaging with full traceability and is sourced directly from authorized JBC distribution channels - ensuring genuine material specifications and norm-compliant thermal conductivity ratings per DIN EN ISO 9000 quality standards.
JBC Soldering Tips - Product Overview
| Series / Type | Compatible Iron | Temperature Range | Tip Geometry | Application |
|---|---|---|---|---|
| C210 Cartridges | T210 / T245 handles | 90-450 °C | Conical 0.1 mm - chisel 4 mm | SMD, THT, fine-pitch rework |
| C245 Cartridges | T245 / T245-A handles | 90-450 °C | Knife, chisel up to 12 mm, bevel | Heavy joints, connectors, drag soldering |
| C115 / C120 Tips | T115 micro iron | ca. 150-400 °C | Micro-conical from 0.1 mm | Micro-BGA, QFN, sensor leads |
| C130 Desoldering Tips | T130 desoldering iron | ca. 200-420 °C | Hollow nozzle 0.8-1.6 mm | Through-hole desoldering, solder removal |
| Classic Series Tips | Legacy JBC irons | ca. 150-450 °C | Conical, chisel, hoof variants | Maintenance, repair, service depots |
Typical application areas: Electronics manufacturing and SMT assembly (IPC-A-610, IEC 61340-5-1), PCB rework and BGA reballing (IPC-7711/7721), semiconductor packaging and wafer-level inspection (SEMI S1/S2), medical device assembly (ISO 13485), automotive electronics and ECU repair (IATF 16949, VDA 6.3), aerospace and defense electronics (AS9100), R&D laboratories and prototype development.