Soldering and desoldering tips

OKI

The OKI SxP range covers soldering and desoldering tips for ESD-safe handpieces and rework stations. Available tip geometries include conical (from 0.4 mm), chisel (30°, 1-5 mm widths), bevelled (60°), hoof-shaped and knife-shaped, covering the full range from fine-pitch work to large-area THT joints. The RxP rework tips address SOIC, PLCC and related IC packages.

Long conical tips (e.g. SFP-CNL04, 0.4x14.9 mm) and angled variants (SFP-CNB05) provide access to restricted component locations on densely populated boards. RxP desoldering tips in slot and tunnel configurations support SOIC-8/14-16 and PLCC 32/44.

Conical (C/CN) - from 0.4 mm diameter, for fine-pitch SMD and 0402/0201 components
Chisel 30° (CH) - 1-5 mm width, for through-hole components and SMD rework
Bevelled 60° (BVL) - 1-14 mm contact area, for pad heating and ground-plane soldering
Hoof-shaped (DRH) - 0.5-3.5 mm, for SMD rework with solder addition
Knife-shaped (DRK) - 5 mm, for solder bridges and IC pin rework
Rework RxP (blade, slot, tunnel, quad) - SOIC-8/14-16, PLCC 32/44
TaskRecommended typeExample
SMD fine-pitch, 0402Conical 0.4 mmSFP-CN04
THT through-hole assemblyChisel 30°, 1.5-2 mmSFP-CH15, SFP-CH20
Ground-plane, pad heatingBevelled 60°, 1-5 mmSFP-BVL10, SFP-CH50
Restricted access areasLong conical / angledSFP-CNL04, SFP-CNB05
SOIC reworkTunnel RxPRFP-DL1, RFP-DL2
PLCC reworkQuad RxPRFP-QD4 (PLCC 32), RFP-QD6 (PLCC 44)

Typical applications: SMT hand soldering and rework in electronics manufacturing, repair and touch-up of populated assemblies (SMD/THT), IC replacement (SOIC, PLCC) at rework stations, and laboratory or prototyping environments with varied soldering tasks.

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