Soldering tips S

Soldering and desoldering tips

The Thermaltronics S series are cartridge tips for the TMT-2000S station, sharing the same geometry family as the K series. The range covers Micro Fine conical tips from 0.1 mm (S60C001), bevelled 45°/60° types from 0.7-6 mm (S60BV007-S60BV060), half-tinned BVF variants and chisel types 30° from 0.6-1.78 mm. Hoof-shaped and knife-shaped variants complete the spectrum. As in the K series, BVF tips are tinned only on the bevelled face, and Power Plus types (H suffix) are available for thermally demanding joints.

Conical S60C (Micro Fine) - 0.1 / 0.2 / 0.4 mm, for 0201/0402 SMD and fine-pitch ICs
Bevelled 45°/60° S60BV - 0.7-6 mm, standard THT and SMD applications
BVF (half-tinned) S60BVF - 1-6 mm, controlled solder flow during pad heating
Chisel 30° S60CH/S60CB - 0.6-1.78 mm, through-hole and SMD chip soldering
Hoof-shaped and knife-shaped - for chip rework with solder addition and solder bridges
Station TMT-2000S - direct equivalent of K tips at the same geometry code

S tips and K tips share identical geometry codes (e.g. S60BV030 = K60BV030 in shape) but differ in cartridge interface: S tips fit TMT-2000S handpieces, K tips fit TMT-9000S handpieces. The two cartridge systems are not cross-compatible. The shape selection is identical between both series, so the same selection criteria apply.

Typical applications: Fine-pitch SMD hand soldering at the TMT-2000S station, rework of 0201/0402 components with Micro Fine tips, THT through-hole assembly with chisel tips, ground-plane joints with bevelled types (S60BV050-060), and controlled pad heating with half-tinned BVF tips during repair work.

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