Soldering and desoldering tips
Thermaltronics
Thermaltronics soldering and desoldering tips are engineered with a copper-core construction and proprietary TMT (Thermal Management Technology) alloy coating, delivering tip-to-heater thermal resistance values as low as 1.5 °C/W and temperature stability within ±2 °C at the working point. The five tip series - K, M, P, S, and T - cover geometries from fine conical points below 0.5 mm through chisel widths up to 10 mm, addressing IPC-J-STD-001 and IPC-7711/7721 process requirements for precision SMT rework, through-hole assembly, and high-thermal-mass desoldering tasks.
As a specialist distributor for Thermaltronics soldering technology, esd.equipment stocks over 1,005 tip references from the complete K, M, P, S, and T series. All tips are manufactured to RoHS 2 (2011/65/EU) compliance, are lead-free solder compatible, and are designed for direct fit into Thermaltronics TMT-9000S, TMT-2000S, and compatible handpiece systems - ensuring consistent, norm-compliant EPA workstation integration per IEC 61340-5-1.
Thermaltronics Tip Series - Technical Comparison
| Criterion | Series K | Series M | Series P | Series S | Series T |
|---|---|---|---|---|---|
| Tip geometry | Knife / bevel | Micro-conical / mini-chisel | Pointed conical | Spade / hoof | Chisel |
| Tip size range | ca. 3-8 mm edge | 0.5-2.0 mm | <1.0 mm apex | 1.0-6.0 mm | 1.0-10 mm |
| Primary application | Drag soldering, bridge removal | SMT fine-pitch, 0402/0201 | QFP, IC lead rework | SOIC, flat-pad desoldering | Through-hole, heavy wire |
| Thermal contact area | High (broad edge) | Low-medium | Very low (point) | Medium-high | Medium-high |
| Lead-free compatible | ✓ Yes | ✓ Yes | ✓ Yes | ✓ Yes | ✓ Yes |
| Compatible stations | TMT-9000S, TMT-2000S | TMT-9000S, TMT-2000S | TMT-9000S, TMT-2000S | TMT-9000S, TMT-2000S | TMT-9000S, TMT-2000S |
| IPC norm reference | IPC-J-STD-001 | IPC-J-STD-001 | IPC-7711/7721 | IPC-7711/7721 | IPC-J-STD-001 |
Typical application areas: Electronics manufacturing SMT assembly (IPC-J-STD-001, IPC-A-610), PCB rework and repair (IPC-7711/7721), semiconductor packaging and wire bonding, medical device manufacturing (ISO 13485), automotive electronics assembly (IATF 16949, VDA 6.3), aerospace and defence electronics (AS9100), ESD-controlled EPA workstations (IEC 61340-5-1)
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