Soldering tips K
Soldering and desoldering tips
The Thermaltronics K series are cartridge soldering tips for the TMT-9000S station. The range includes conical Micro Fine tips from 0.1 mm (K60C001) up to 0.4 mm, bevelled types (45°/60°) in widths from 0.7-6 mm, chisel tips (30°) from 0.6-1.78 mm, as well as hoof-shaped and knife-shaped variants. Tips with "BVF" designation are tinned only on the bevelled face, which limits solder flow precisely when heating pads. Power Plus tips (H suffix) provide higher thermal mass for heat-demanding joints on ground planes and copper pours.
| Task | Type | Example |
|---|---|---|
| 0201 / 0402 SMD | K60C001 / K60C002 (Micro Fine) | K60BV004, K60C001 |
| Standard SMD / THT | K60BV bevelled | K60BV020, K60BV030 |
| Controlled pad heating | K60BVF (half-tinned) | K60BVF020, K60BVF030 |
| Fine-pitch chisel | K60CH Micro Fine | K60CH006, K60CH008 |
| Ground-plane joints | K60BV large / Power Plus | K60BV050, K60BV060 |
Typical applications: Fine-pitch SMD hand soldering at the TMT-9000S station, rework of 0201/0402 components with Micro Fine tips, THT through-hole assembly with chisel tips, ground-plane and copper-pour joints with Power Plus types, and controlled pad heating with half-tinned BVF tips.























