Soldering tips K

Soldering and desoldering tips

The Thermaltronics K series are cartridge soldering tips for the TMT-9000S station. The range includes conical Micro Fine tips from 0.1 mm (K60C001) up to 0.4 mm, bevelled types (45°/60°) in widths from 0.7-6 mm, chisel tips (30°) from 0.6-1.78 mm, as well as hoof-shaped and knife-shaped variants. Tips with "BVF" designation are tinned only on the bevelled face, which limits solder flow precisely when heating pads. Power Plus tips (H suffix) provide higher thermal mass for heat-demanding joints on ground planes and copper pours.

Conical K60C (Micro Fine) - 0.1 mm / 0.2 mm / 0.4 mm, for 0201/0402 SMD and fine-pitch ICs
Bevelled 45°/60° K60BV - 0.7-6 mm, standard THT and SMD applications
BVF (half-tinned) K60BVF - 1-6 mm, controlled solder flow during pad heating
Chisel 30° K60CH/K60CB - 0.6-1.78 mm, through-hole and SMD chip soldering
Hoof-shaped K60BV (Dent) - for chip components with solder addition
Power Plus (H suffix) - higher thermal reserve for ground pads and copper areas

TaskTypeExample
0201 / 0402 SMDK60C001 / K60C002 (Micro Fine)K60BV004, K60C001
Standard SMD / THTK60BV bevelledK60BV020, K60BV030
Controlled pad heatingK60BVF (half-tinned)K60BVF020, K60BVF030
Fine-pitch chiselK60CH Micro FineK60CH006, K60CH008
Ground-plane jointsK60BV large / Power PlusK60BV050, K60BV060

Typical applications: Fine-pitch SMD hand soldering at the TMT-9000S station, rework of 0201/0402 components with Micro Fine tips, THT through-hole assembly with chisel tips, ground-plane and copper-pour joints with Power Plus types, and controlled pad heating with half-tinned BVF tips.

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  1. Chisel soldering tip 30° 3.2 mm (0.13") for SHP-K/SHP-KM - Thermaltronics K80CH032A
    €11.38
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