Hakko T32 Serie - TEC
Hakko Soldering and Desoldering Tips
The Hakko T32 series delivers precision soldering tips engineered for the Hakko FX-100 induction-heating soldering station, operating at temperatures from 200 °C to 450 °C with a thermal recovery that keeps tip-to-target deviation under ±2 °C during continuous production cycles. Tip geometry ranges from ultra-fine conical points (0.2 mm) through knife and chisel profiles up to 6.5 mm blade widths, covering every pad geometry found in SMT rework, through-hole assembly, and fine-pitch QFP/BGA work. The tips conform to IEC 61191 soldering process requirements and support RoHS-compliant lead-free alloys (Sn-Ag-Cu) at standard process temperatures without accelerated tip erosion.
As a specialist distributor for professional soldering equipment, esd.equipment stocks 24 Hakko T32 tip variants ready for immediate dispatch, giving electronics assembly workshops, repair facilities, and ESD-controlled production lines single-source access to the full geometry portfolio. Each T32 tip ships with Hakko's factory quality certification and is compatible with the FX-100 station's integrated ESD-safe tip-grounding circuit, keeping tip potential below 2 mV to protect ESD-sensitive components per IEC 61340-5-1.
Hakko T32 Series - Product Overview
| Tip Type | Geometry / Size | Typical Application | Compatible Station |
|---|---|---|---|
| Conical sharp | 0.2 mm point | Fine-pitch QFP, 0402 SMD components | Hakko FX-100 |
| Conical | 1.0 mm point | General SMT rework, through-hole leads | Hakko FX-100 |
| Chisel | 2.0 mm blade | IC leads, connector pins, drag soldering | Hakko FX-100 |
| Chisel | 3.5 mm blade | Power connectors, large pad areas | Hakko FX-100 |
| Knife | 4.0 mm angled blade | SOIC, QFP drag soldering, wire tinning | Hakko FX-100 |
| Blade | 6.5 mm flat | Heat distribution, large joint rework | Hakko FX-100 |
Typical application areas: Electronics manufacturing and SMT assembly (IPC-A-610, IEC 61191), ESD-controlled rework stations (IEC 61340-5-1), semiconductor and PCB repair (SEMI S1/S2), medical device manufacturing (ISO 13485), automotive electronics assembly (IATF 16949, VDA 6.3), and aerospace soldering operations (AS9100).