Soldering tips STTC - TEC
Soldering and desoldering tips
The Metcal STTC soldering tip series is engineered for precision hand soldering with SmartHeat technology, delivering power-on-demand through a curie-point self-regulating system that maintains tip temperature within ±2 °C without a separate control station. STTC tips are compatible with the MX-500 and MX-5200 handpiece systems and cover a working temperature range of 200-450 °C, with tip geometries spanning conical, chisel, bevel, and knife profiles for fine-pitch SMD work down to 0201 components as well as through-hole and drag-soldering applications. Thermal mass is optimised for lead-free alloys (Sn96.5Ag3Cu0.5) at standard process temperatures of 350-370 °C, meeting IPC J-STD-001 and IEC 61191 workmanship requirements.
As an authorised distributor for Metcal soldering technology, esd.equipment stocks 127 STTC series tip variants ready for immediate dispatch - covering all standard geometries, sizes from 0.25 mm conical through to 6.0 mm chisel, and specialised profiles for rework and repair. All tips are RoHS-compliant and produced to Metcal factory tolerances, backed by full documentation for regulated-industry traceability under ISO 9001 and AS9100 quality frameworks.
STTC Series - Tip Geometry and Application Overview
| Tip Style | Geometry | Typical Size Range | Primary Application |
|---|---|---|---|
| Conical (sharp) | Pointed, <0.5 mm | 0.25-0.4 mm | Fine-pitch SMD, 0201, touch-up |
| Chisel | Flat, angled face | 0.8-6.0 mm | Through-hole, drag soldering, general work |
| Bevel | 45° angled face | 1.0-3.2 mm | QFP, SOIC drag soldering, pads |
| Knife / Blade | Extended blade edge | 1.5-3.0 mm | IC lead cutting, PLCC, rework |
| Hoof / Gull-wing | Curved inner face | 1.2-2.4 mm | Gull-wing leads, drag on QFP/SOP |
| Barrel / Micro | Rounded barrel tip | 0.4-1.0 mm | Micro joints, wire tinning, repair |
Typical application areas: PCB assembly and SMT production (IPC J-STD-001, IPC-A-610), electronics rework and repair (IEC 61191-1), semiconductor and microelectronics manufacturing (SEMI S8), medical device assembly (ISO 13485), aerospace and defence electronics (AS9100D, MIL-STD-2000), automotive electronics production (IATF 16949, VDA 6.3)