Packaging bag
ESD Beutel
- Warmbier 3113.1250.1850. ESD Permastat side gusseted bag, pink, 1250x850x1850x0.15 mm€333.44Excl. 19% VAT , excl. Shipping Cost
- Warmbier 3113.1250.0900. ESD Permastat side gusseted bag, pink, 1250x850x900x0.15 mm€171.20Excl. 19% VAT , excl. Shipping Cost
- Warmbier 3710.DR.1626. ESD DRY-SHIELD shielding bag, silver, 406x660 mm, 100 pieces€130.27Excl. 19% VAT , excl. Shipping Cost
- Warmbier 3710.DR.1818. ESD DRY-SHIELD shielding bag, silver, 457x457 mm, 100 pieces€107.24Excl. 19% VAT , excl. Shipping Cost
- Warmbier 3715.DR.1626.A. ESD Dry Shield packaging bag, silver, 406x660 mm, 100 pieces€97.75Excl. 19% VAT , excl. Shipping Cost
ESD packaging bags provide a critical electrostatic discharge barrier for sensitive electronic components during storage and transport. Surface resistance values typically range from 10⁵ to 10¹¹ Ω depending on material type - shielding bags combine a metallic layer for field attenuation to <1 nJ (per ANSI/ESD S11.31), while dissipative polyethylene bags achieve 10⁶-10⁹ Ω for internal charge dissipation in compliance with IEC 61340-5-1 and DIN EN 61340-3-1. Moisture-barrier variants offer water vapor transmission rates (WVTR) as low as 0.02 g/m²/day, protecting against humidity-induced corrosion on PCB assemblies and bare die components.
This category offers 205 packaging bag products covering shielding bags, dissipative bags, antistatic poly bags, zipper-seal bags, and vacuum-sealable formats for EPA-compliant component handling. All products are selected for conformance to IEC 61340-5-1, ANSI/ESD S541, and MIL-PRF-81705 Class 1/2 requirements, ensuring traceability and auditability in regulated manufacturing environments.
ESD Bag Types - Technical Comparison
| Criterion | Shielding Bag (Metallic) | Dissipative Pink Poly Bag | Antistatic Bubble Bag | Conductive Black Bag |
|---|---|---|---|---|
| Surface resistance | 10⁶-10¹¹ Ω | 10⁶-10⁹ Ω | 10⁹-10¹⁶ Ω | <10³ Ω |
| Electrostatic shielding | <1 nJ (ANSI S11.31) | None | None | Partial (Faraday) |
| Applicable norm | IEC 61340-5-1, MIL-PRF-81705 Type I/III | IEC 61340-5-1, ANSI S541 | ANSI S541 | IEC 61340-5-1 |
| Moisture barrier (WVTR) | <0.02 g/m²/day | None | None | None |
| Typical use | ESDS storage and shipping outside EPA | In-process EPA component storage | Padded transit of PCBs | Wafer and high-density IC packaging |
| Transparency | Semi-transparent (silver/clear) | Transparent pink | Transparent with bubble layer | Opaque black |
| Closure options | Zipper, heat-seal, press-seal | Zipper, open-top | Zipper, fold-over | Heat-seal, open-top |
| Reusability | ca. 20-50 cycles (zipper type) | ca. 10-30 cycles | Limited (single-use recommended) | Single-use (heat-seal) |
Typical application areas: Electronics manufacturing and SMT assembly (IPC-A-610, IEC 61340-5-1), semiconductor wafer and bare die handling (SEMI E78), medical device manufacturing (ISO 13485), automotive electronics and control units (IATF 16949, VDA 6.3), aerospace and defense component packaging (AS9100, MIL-PRF-81705), and in-process ESDS handling within established EPA environments (ANSI/ESD S20.20).























