Packaging bag

ESD Beutel

View as Grid List

Items 1-24 of 205

Set Ascending Direction
Page
per page

ESD packaging bags provide a critical electrostatic discharge barrier for sensitive electronic components during storage and transport. Surface resistance values typically range from 10⁵ to 10¹¹ Ω depending on material type - shielding bags combine a metallic layer for field attenuation to <1 nJ (per ANSI/ESD S11.31), while dissipative polyethylene bags achieve 10⁶-10⁹ Ω for internal charge dissipation in compliance with IEC 61340-5-1 and DIN EN 61340-3-1. Moisture-barrier variants offer water vapor transmission rates (WVTR) as low as 0.02 g/m²/day, protecting against humidity-induced corrosion on PCB assemblies and bare die components.

This category offers 205 packaging bag products covering shielding bags, dissipative bags, antistatic poly bags, zipper-seal bags, and vacuum-sealable formats for EPA-compliant component handling. All products are selected for conformance to IEC 61340-5-1, ANSI/ESD S541, and MIL-PRF-81705 Class 1/2 requirements, ensuring traceability and auditability in regulated manufacturing environments.

Key technical advantages - Packaging Bags at a glance
Surface resistance 10⁵-10¹¹ Ω - dissipative and shielding types per IEC 61340-5-1
🛡 Shielding <1 nJ - metallic barrier attenuates electrostatic fields per ANSI/ESD S11.31
🔍 WVTR <0.02 g/m²/day - moisture-barrier film protects PCBs and bare die from humidity
Multiple closure types - zipper-seal, heat-seal, and fold-over formats for flexible EPA workflow
📦 205 products in stock - wide size range from small component bags to large board-level packaging
MIL-PRF-81705 / ANSI S541 - norm-compliant for aerospace, defense, and industrial electronics

ESD Bag Types - Technical Comparison

Criterion Shielding Bag (Metallic) Dissipative Pink Poly Bag Antistatic Bubble Bag Conductive Black Bag
Surface resistance 10⁶-10¹¹ Ω 10⁶-10⁹ Ω 10⁹-10¹⁶ Ω <10³ Ω
Electrostatic shielding <1 nJ (ANSI S11.31) None None Partial (Faraday)
Applicable norm IEC 61340-5-1, MIL-PRF-81705 Type I/III IEC 61340-5-1, ANSI S541 ANSI S541 IEC 61340-5-1
Moisture barrier (WVTR) <0.02 g/m²/day None None None
Typical use ESDS storage and shipping outside EPA In-process EPA component storage Padded transit of PCBs Wafer and high-density IC packaging
Transparency Semi-transparent (silver/clear) Transparent pink Transparent with bubble layer Opaque black
Closure options Zipper, heat-seal, press-seal Zipper, open-top Zipper, fold-over Heat-seal, open-top
Reusability ca. 20-50 cycles (zipper type) ca. 10-30 cycles Limited (single-use recommended) Single-use (heat-seal)

Typical application areas: Electronics manufacturing and SMT assembly (IPC-A-610, IEC 61340-5-1), semiconductor wafer and bare die handling (SEMI E78), medical device manufacturing (ISO 13485), automotive electronics and control units (IATF 16949, VDA 6.3), aerospace and defense component packaging (AS9100, MIL-PRF-81705), and in-process ESDS handling within established EPA environments (ANSI/ESD S20.20).

Norm-Compliant ESD Bags IEC 61340-5-1, ANSI/ESD S541, MIL-PRF-81705 Class I/III certified products
📦
205 Products in Stock Shielding, dissipative, antistatic, and conductive bag formats ready for immediate dispatch
🛡
Full EPA Coverage From component-level to board-level packaging - complete ESD protection outside the EPA