Desiccant
ESD Packaging
- SAFEGUARD. Desiccant bag, 1/2 unit, bentonite clay in granular form, VPE = 1.000 pcs.€94.56Excl. 19% VAT , excl. Shipping Cost
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Desiccants for ESD-compliant packaging control residual moisture to levels below 10% RH inside sealed moisture barrier bags (MBB), directly supporting IEC 61340-5-1 and IPC/JEDEC J-STD-033 requirements for moisture-sensitive devices (MSD Level 1-6). Silica gel, molecular sieve, and clay-based desiccants absorb between 20% and 35% of their own weight in water vapour, maintaining a stable dry environment across storage temperatures from -40 °C to +80 °C. Correct desiccant sizing - calculated per JEDEC J-STD-033 Annex B using bag permeation rate and shelf-life target - is critical to preventing solder-joint defects, delamination, and parametric failures in SMT reflow processes.
esd.equipment supplies 33 desiccant products covering unit sizes from 1/6 HU to 80 g, including humidity indicator cards (HIC) compliant with MIL-I-8835 and IPC-1601. All products are compatible with standard ESD moisture barrier bags per ANSI/ESD S541 and DIN EN 61340-5-3, and are stocked for immediate dispatch to electronics manufacturing, semiconductor handling, and aerospace assembly operations worldwide.
Silica Gel vs. Molecular Sieve vs. Clay Desiccant - technical comparison
| Criterion | Silica Gel | Molecular Sieve (4A) | Clay (Bentonite) |
|---|---|---|---|
| Absorption capacity | ca. 30-35% of own weight | ca. 20-22% of own weight | ca. 25% of own weight |
| Target RH inside bag | <10% RH (J-STD-033) | <5% RH achievable | <15% RH typical |
| Operating temperature | -40 °C to +80 °C | -40 °C to +300 °C | -40 °C to +65 °C |
| Regeneration possible | Yes - 120 °C / 2 h | Yes - 250-300 °C / 2 h | Yes - 105 °C / 2 h |
| Standard compliance | J-STD-033, IPC-1601, DIN 55473 | J-STD-033, MIL-D-3464 | MIL-D-3464 Type II |
| Typical application | MSD Level 2-5a, ESD MBB | Ultra-dry component storage | Long-term transport packaging |
| HIC indicator compatible | Yes - MIL-I-8835 / IPC-1601 | Yes | Yes |
Typical application areas: SMT electronics manufacturing with MSD component handling (IPC/JEDEC J-STD-033, IPC-1601), semiconductor device packaging and dry storage (SEMI S1/S2), medical device assembly requiring validated humidity control (ISO 13485), automotive electronics supply chain with moisture-sensitive IC protection (IATF 16949, VDA 6.3), aerospace and defence component preservation (AS9100, MIL-D-3464), and PCB assembly incoming goods inspection and kitting operations (IEC 61340-5-1, ANSI/ESD S541).












