Soldering tips T

Soldering and desoldering tips

The Thermaltronics T-Series tips are engineered with a copper core and iron-clad Curie-point technology, delivering a tip-to-ground resistance of <2 Ω and an electrostatic potential of <2 mV - meeting the stringent EPA requirements of IEC 61340-5-1 and J-STD-001. Operating across a temperature range of 100-450 °C, each T-Series tip maintains ±1 °C setpoint accuracy, ensuring repeatable, process-stable solder joints on lead-free (SAC305) and tin-lead alloys alike.

As an authorised Thermaltronics distributor, esd.equipment stocks 219 T-Series tip variants - from fine conical points and chisel profiles to hoof and micro-grooved specialty geometries - all interchangeable with Thermaltronics TMT and MX series handpieces. Every tip ships from warehouse stock with full compliance documentation for IPC-A-610 and J-STD-001 soldering process qualification.

Key technical advantages - Thermaltronics T-Series tips at a glance
Tip-to-ground <2 Ω - ESD-safe design per IEC 61340-5-1, protects sensitive components in EPA environments
🔍 ±1 °C setpoint accuracy - Curie-point thermal regulation for repeatable, process-stable soldering
100-450 °C range - Compatible with SAC305 lead-free and Sn63Pb37 tin-lead processes
🛠 219 tip geometries - Conical, chisel, hoof, bevel and micro-groove profiles for every joint type
🛡 Electrostatic potential <2 mV - Full J-STD-001 and IPC-A-610 compliance for certified solder process qualification
Direct handpiece fit - Drop-in interchange with Thermaltronics TMT and MX series stations - no adapters required

Thermaltronics T-Series - Product overview

Tip profile T-Series code Typical application Key feature
Conical sharp T-I series SMD rework, fine-pitch IC legs 0.2 mm point diameter for precision access
Chisel T-CH series Through-hole PTH, wire soldering High thermal mass, fast heat transfer to pad
Hoof / knife T-HF series Drag soldering, SOIC / QFP packages Angled face retains solder during drag pass
Bevel T-B series General-purpose SMT and THT 45° face for dual-purpose point and side contact
Micro-groove T-MG series BGA reballing, micro-pad rework Grooved channel controls solder volume precisely
Spoon / concave T-SP series Component removal, desoldering bridges Concave cup collects molten solder for clean lift-off

Typical applications: Electronics manufacturing and SMT assembly (IPC-A-610, J-STD-001), semiconductor module rework (SEMI S1/S2), medical device PCB soldering (ISO 13485), automotive electronics repair (IATF 16949, VDA 6.3), aerospace and defence soldering operations (AS9100), and ESD-controlled EPA production lines (IEC 61340-5-1).

219 T-Series variants in stock Conical, chisel, hoof, bevel, micro-groove and spoon profiles - ready to ship
ESD-safe: <2 Ω tip-to-ground Meets IEC 61340-5-1 and J-STD-001 for EPA-compliant soldering stations
🛡
Authorised Thermaltronics distributor Full compliance documentation - IPC-A-610, J-STD-001, ISO 13485 process support
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