ESD Packaging - TEC
Storage Solutions
ESD packaging is the first and last line of defence for electrostatic-sensitive assemblies and components. Certified shielding bags achieve a surface resistance of 10¹² Ω or less and a shielding attenuation of >40 dB per IEC 61340-5-1, while ESD foam materials typically deliver a volume resistivity between 10⁵ and 10⁷ Ω·cm - making them suitable for direct contact with PCBA surfaces rated up to Class 1 per ANSI/ESD S20.20. Moisture-barrier pouches combined with desiccant achieve humidity levels below 20 % RH for MSL-sensitive ICs per IPC/JEDEC J-STD-033.
This section covers 818 products across 10 ESD packaging subcategories - from shielding bags and air-cushion films to big bags, foil sealing equipment, desiccants, and rigid ESD cases. All product groups are aligned to IEC 61340-5-1, IEC 61340-5-2, ANSI/ESD S20.20, and IPC/JEDEC J-STD-033, supporting full EPA-compliant packing and shipping workflows in electronics manufacturing, semiconductor handling, and precision assembly environments.
ESD Packaging types - technical comparison
| Criterion | Shielding bags / films | Dissipative foam | Conductive shipping boxes | Rigid ESD cases |
|---|---|---|---|---|
| Surface / volume resistance | 10¹² Ω (shielding layer) | 10⁵-10⁷ Ω·cm | 10⁶-10⁷ Ω | 10⁵-10⁷ Ω (lining) |
| Shielding attenuation | >40 dB (Faraday cage) | None (dissipative only) | Low (dissipative) | ca. 20-40 dB |
| Primary standard | IEC 61340-5-1, ANSI/ESD S541 | IEC 61340-5-1 | IEC 61340-5-1 | ANSI/ESD S20.20 |
| Moisture barrier (MSL) | Yes - MBB type, <20 % RH | No | No | Optional (with desiccant) |
| Mechanical protection | Air-cushion variants available | High (cushioning) | Medium (stacking >50 kg) | Very high (rigid shell) |
| Typical use case | PCBs, ICs, sensitive assemblies | Component trays, inserts | Outbound ESD shipping | Field service, transport |
| Reusability | Limited (resealable versions) | High (cut-to-fit) | Medium | Very high |
Typical application areas: Electronics manufacturing and SMT line packing (IEC 61340-5-1, IPC-A-610), semiconductor wafer and die shipping (SEMI E78, ANSI/ESD S541), moisture-sensitive device handling MSL 1-6 (IPC/JEDEC J-STD-033), medical device assembly and sterilisation packaging (ISO 13485), automotive electronics supply chain (IATF 16949, VDA 6.3), aerospace component transport and kitting (AS9100), and field service kit preparation for ESD-sensitive repair workflows.