Soldering and desoldering tips - ESD (antistatic)
Metcal Löttechnik
Metcal soldering and desoldering tips use SmartHeat technology with fixed operating temperatures between 260 °C and 360 °C, regulated directly at the tip via RF induction at 13.56 MHz - eliminating setpoint drift and delivering <0.5 °C thermal overshoot under load. Tip series cover contact widths from 0.1 mm (UFTC ultra-fine cartridges) up to 18 mm chisel profiles (STDC/STTC), with iron-clad copper cores plated in nickel and chrome for >50,000 joint service life per IPC J-STD-001.
As an authorised Metcal distributor, esd.equipment stocks 333 tip and cartridge references across 8 series - SSC, STTC, STDC, PTTC, UFTC, TATC tweezer tips, SMTC rework tips, and solder cartridges - all compatible with the MX-500, GT-90, CV-5200, and OKi PS-900 handpieces. Every series meets IEC 61010-1 safety requirements and ESD protection to IEC 61340-5-1 (<1 Ω tip-to-ground path).
Metcal tip series overview - soldering cartridge comparison
| Criterion | SSC / STTC | STDC | UFTC / PTTC | TATC / SMTC |
|---|---|---|---|---|
| Primary application | General PCB soldering, through-hole & SMD | High-mass joints, connectors, wires | Micro-BGA, 01005, fine-pitch <0.5 mm | SMD rework, QFP, SOIC, chip removal |
| Tip size range | 0.2-18 mm | 1.6-14.0 mm | 0.1-1.0 mm | Dual / profile-specific |
| Compatible handpiece | MX-500, MX-RM3E, GT-90 | CV-5200 | PS-900 (PTTC), MX-500 (UFTC) | MX-RM3E tweezer / rework station |
| Temperature range | 260-360 °C (alloy-coded) | 260-360 °C | 260-360 °C | 260-360 °C |
| Key profile types | Conical, chisel, bevel, knife, spoon | Chisel, blade, hoof | Conical micro, pencil-point | Dual-point tweezer, QFP paddle, wave |
| ESD protection | <1 Ω tip-to-ground (IEC 61340-5-1) | <1 Ω tip-to-ground | <1 Ω tip-to-ground | <1 Ω tip-to-ground |
| Standard certification | IPC J-STD-001, IEC 61010-1 | IPC J-STD-001 | IPC J-STD-001 | IPC J-STD-001, IPC-7711/7721 |
| Typical service life | >50,000 joints (Ni/Cr plated Cu) | >50,000 joints | ca. 30,000-50,000 joints | ca. 30,000 cycles |
Typical application areas: Electronics manufacturing and PCB assembly (IPC J-STD-001, IPC-A-610), semiconductor and wafer-level rework (SEMI S1/S2), medical device production (ISO 13485), automotive electronics (IATF 16949, VDA 6.3), aerospace and defense soldering (AS9100, IPC-7711/7721), R&D laboratories and prototype assembly (IEC 61010-1).