PCB Preheaters
Reeco Soldering Technology
Multilayer boards with large copper areas pull heat away from the joint. Compensating for that with the iron or hot air alone means working at a far higher temperature, which damages components, solder resist and vias. A preheater brings the assembly up to temperature from below, so much less energy is needed from above.
Reeco covers three performance classes: the compact IR-860 with a 130 x 130 mm heating surface for the repair bench, the PH-A3 convection preheater with three separately controlled zones over 300 x 420 mm, and the QPH-A3 quartz preheater whose elements respond almost without delay. PH-A3 and QPH-A3 control on the component temperature actually measured by three external thermocouples.
| Model | Design | Area | Temperature | Stability | Power |
|---|---|---|---|---|---|
| RE-IR-860 | Hot plate | 130 x 130 mm | 50 to 350 °C | ±1 °C | 400 W |
| RE-PHA3 | Convection, 3 zones | 300 x 420 mm | 100 to 350 °C | ±5 °C | 4 kW |
| RE-QPHA3 | Quartz, 3 zones | 300 x 420 mm | 100 to 370 °C | ±5 °C | 3.2 kW |
Typical applications: Preheating before removing and fitting BGA, QFP and PLCC components, repair of servers, notebooks, industrial controls and consumer devices, work on boards with large ground planes and reballing of BGA components together with a hot air station.
