Underheater
JBC soldering technology
JBC underheaters (preheaters) warm PCBs from below before a soldering iron or hot-air tool is applied on the component side. The range extends from the compact nano unit PHNE-2KA (230 V, 300 W) through mid-range models such as PHSE-2KB (500 W) and PHBE-2KB (1800 W) up to the large-area PHXLE-2KA (230 V, 5400 W) for boards up to 510 x 610 mm. PCB holders PHB and PHS are supplied separately or as a set; desk-mount kits (PHB-STA, PHS-STA) enable integration into existing rework benches.
| Model | Power | Board size / notes |
|---|---|---|
| PHNE-2KA | 300 W | Nano, incl. PCB holder |
| PHSE-2KB | 500 W | Incl. PCB holder |
| PHSE-2B | 600 W | Without PCB holder |
| PHXLE-2A | 540 W | Without PCB holder |
| PHBE-2KB / PHBE-2B | 1800 W | With / without PCB holder |
| RBB-2A | 1800 W | RBB underheater |
| RBN-2A | 300 W | RBN underheater |
| PHXLE-2KA | 5400 W | Up to 510 x 610 mm, incl. holder |
| PHXLE-1KA | Set | Up to 510 x 610 mm (preheating set) |
Typical applications: BGA rework and BGA reballing with uniform bottom-side board heating, rework of lead-free assemblies requiring elevated process temperatures, desoldering of multilayer PCBs with high thermal mass, and repair of power assemblies with copper-rich inner layers where localised heating alone is insufficient.
