Reeco Soldering Technology
BGA Reballing
Reballing stands or falls on alignment. If the stencil sits off by half a ball width, the solder balls land next to the pads and the component is lost. The RE-RKIT holder clamps component and stencil against each other, and a locking system with spacer beads keeps the stencil flat on the package.
The stencils are not universal parts. Pitch, ball diameter and layout differ from component to component, so each stencil is made to the technical data of the specific package, or to a sample sent in. It is ordered as RE-SZABLON. The frame is made from aluminium alloys and stays true over many cycles.
- 2 items
- 1 manufacturer
- Net prices plus VAT
Buying guide
How to choose BGA Reballing
What matters when choosing: properties, comparison and typical applications.
Features and equipment
Overview
| Article | Function | Material | Note |
|---|---|---|---|
| RE-RKIT | Holder for reballing stencils | Aluminium alloy | reusable, the stencil is added per component type |
| RE-SZABLON | Reballing stencil | Aluminium alloy | made to the technical data or a sample of the component |
Typical applications
Typical applications: Reballing of BGA and µBGA components in repair shops, overhaul of industrial electronics and servers, electronics laboratory and development work, refurbishment of discontinued components for which no replacement is available.