Clothing

Finger cots

ESD finger cots protect moisture-sensitive and electrostatically sensitive components from fingerprints, skin oils and electrostatic discharge during direct handling. The range includes conductive latex finger cots from EGB and Safeguard CONDUCTEX in sizes S to XL, as well as Warmbier finger cots made from conductive latex in black (sizes M and L, 1440 pieces per pack). The EGB finger cots are available as standard, while the Safeguard version is supplied rolled in black and also suits cleanroom-compatible applications (pink latex finger cots).

  • 7 items
  • 3 manufacturers
  • Net prices plus VAT
View as Grid view List view

7 Items

Set Descending Direction
per page
  1. ESD finger cots dissipative, dissipation resistance 10⁸ ohm, pack of 1440
    €45.65

Buying guide

How to choose Finger cots

What matters when choosing: properties, comparison and typical applications.

Technical features

⚡ Conductive latex material - prevents electrostatic charge build-up during component handling in EPA zones
✓ Sizes S / M / L / XL - EGB, Safeguard and Warmbier available for all hand sizes
⚙ Rolled format - easy to slip on, low material waste, stable fit on the finger
📦 Bulk packs up to 1440 pcs - Warmbier 8750.B.M / 8750.B.L for high-throughput manufacturing
✨ Cleanroom-compatible variants - pink latex finger cots for dust-controlled environments (MSL handling)

Selection and usage notes

ProductMaterialColourPack / Notes
EGB finger cotsLatex, conductiven/aStandard, S/M/L/XL
Safeguard CONDUCTEX rolledLatex, conductiveBlackS/M/L/XL, rolled
Latex finger cots pinkLatex, conductivePinkCleanroom-compatible, M/L
Warmbier 8750.B.MLatex, conductiveBlack1440 pcs, size M
Warmbier 8750.B.LLatex, conductiveBlack1440 pcs, size L

Finger cots are pulled over the fingertips and typically reach to the second knuckle. For tasks requiring full hand protection against contamination, ESD gloves are the appropriate choice.

Typical applications

Typical applications: PCB assembly and inspection, handling of IC components and sensors, assembly of optical lenses and camera modules, SMD rework at repair stations, wafer handling in semiconductor manufacturing, and quality inspection of ESD-sensitive assemblies in EPA zones per DIN EN 61340-5-1.