Wafer Tweezers
Tweezers
Wafer tweezers grip semiconductor wafers at the edge or from below without touching the active surface. Instead of pointed ends they carry a stepped paddle, either with 3, 4 or 5 teeth as defined contact points or without teeth for scratch sensitive surfaces. Versions with polyester, PTFE or pyroplast tips avoid metal contact with the wafer, and ESD variants are dissipative to IEC 61340-5-1 at 10⁶ to 10⁹ Ω. The category holds 15 articles from Bernstein and Weller for wafer diameters from 3 to 6 inch.
| Shape | Paddle | Use |
|---|---|---|
| 3 DW | stepped, no teeth | flat edge handling |
| 3 DWF | stepped, 3 teeth | defined contact points |
| 4 DWF | stepped, 4 teeth | medium wafer diameters |
| 5 DWF | stepped, 5 teeth | larger wafers |
| 6 DW | no teeth, matt polished | scratch sensitive surfaces |
Typical applications: Handling silicon wafers in semiconductor production and metrology; loading and unloading wafer cassettes; work under cleanroom conditions; loading and inspection at wafer probers and microscopes; handling substrates and glass plates in thin film technology; research and laboratory work with wafers from 3 to 6 inch.
