Cleanroom technology
Nitto Kohki Pneumatic Solutions
Nitto Kohki clean-room couplings are designed for semiconductor and chip manufacturing, where particulate release and contamination are critical rejection criteria. The range covers two specialised series: the Semicon SP Cupla in stainless steel SUS304 with FKM or EPDM seals, and the Semicon SCT Cupla in PTFE and FEP, which allows chemically inert media contact. Both series connect and disconnect pressure-free, preventing fluid or gas release during coupling.
Semicon SP CuplaStainless steel SUS304, FKM/EPDM, G and NPT connection
Semicon SCT CuplaPTFE/FEP body, chemically inert, for aggressive media
| Feature | Semicon SP | Semicon SCT |
|---|---|---|
| Body material | Stainless steel SUS304 | PTFE, FEP |
| Seal | FKM or EPDM | FEP |
| Thread types | G, NPT, UNS | G, NPT |
| Sizes (nominal) | 1-8 | 2-8 |
| Chemical resistance | High (SUS) | Very high (PTFE/FEP) |
Typical applications: Semiconductor manufacturing (wafer handling, CMP, etch processes), chip test equipment and wafer stepper systems, gas panels and gas dosing systems in chip production, ultrapure water (UPW) circuits, and laboratory systems in pharmaceutical and biotech industries requiring particle-free connections.
