Nitto Kohki Semicon SP Cupla

Nitto Kohki Semicon SP Cupla quick-disconnect couplings are engineered specifically for semiconductor fabrication environments, delivering contamination-free fluid and gas transfer with a residual fluid release of <0.01 ml per connection cycle. The SP series features a double-valve shut-off mechanism that eliminates pressure spikes on connect and disconnect, protecting sensitive wafer-handling equipment and process lines operating at pressures up to 1.0 MPa. Wetted surfaces are machined from electropolished SUS316L stainless steel or high-purity fluoropolymer (PTFE/PFA), achieving metal ion elution levels compliant with SEMI F57 ultrapure water standards.

As an authorised distributor for Nitto Kohki pneumatic and cleanroom coupling technology, esd.equipment stocks 72 Semicon SP Cupla variants covering bore sizes from 2.7 mm to 10.0 mm, with face-seal and tube-end configurations. All couplings in this series are validated for ISO Class 1-4 cleanroom use (ISO 14644-1) and carry compliance documentation for SEMI S2 environmental health & safety guidelines, making them the benchmark choice for wet-bench, CMP, CVD, and etch-tool plumbing.

Nitto Kohki Semicon SP Cupla - Product overview

Typical application areas: Semiconductor wafer fabrication - wet bench and chemical delivery (SEMI F57, SEMI S2), CMP and slurry handling (ISO 14644-1 Class 1-3), CVD and etch-tool process gas lines (SEMI S2), flat-panel display manufacturing cleanrooms (ISO 14644-1 Class 4), medical device precision fluid handling (ISO 13485), analytical laboratory ultra-pure water systems (SEMI F57).