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Hand-operated optical BGA inspection system for viewing solder joints hidden under BGA, CSP and QFN packages. A 90-degree side-view prism probe acts like an inverted periscope to reveal the concealed solder balls. Complete set with 5MP USB3.0 digital microscope, side-view BGA lens and INSPECTIS Basics BGA software.
BGA Inspection System Light, hand-operated, 90-degree side-view - Inspectis BGA-003
INSPECTIS
Original product
Net price (excl. VAT)
€7,936.77
Item
BGA-003
Manufacturer no.
BGA-003
Personal expert advice
Brand new
Specialist dealer since 2009
Original product
Worldwide shipping
Product data
Manufacturer no.BGA-003
Country of originSweden
Customs tariff number85258099
ConditionNew
Article
BGA-003
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Solder joints hidden under BGA, uBGA, FlipChip, CSP and QFN devices cannot be judged from the top. The hand-operated BGA Inspection System Light solves this with a 90-degree side-view prism probe that works like an inverted periscope, looking in under the package and bringing the concealed solder balls to the monitor as a sharp image.
Key benefits
- Side-view under the package: visual assessment of solder balls that top-down optics and even X-ray struggle to evaluate.
- 90-degree prism probe on the periscope principle for a clear lateral view along the solder rows.
- 5MP digital microscope with USB3.0 for high-resolution live images without a frame grabber.
- See from the first row up to 20 rows of BGA solder bumps thanks to adjustable background illumination.
- Hand-operated and portable: complete in an aluminium case, ideal for rework, repair and incoming inspection.
Scope of delivery
- 5MP digital microscope with USB3.0 interface
- Side-view BGA lens (90-degree prism probe)
- INSPECTIS Basics BGA software
- Bench holder for hand-operated use
- Foot switch for image capture
- Aluminium carrying case
Technical specifications
| Sensor | 5.0 MP CMOS |
| Interface | USB 3.0 |
| Inspection principle | 90-degree side-view prism probe (periscope principle) |
| Applicable to | BGA, uBGA, FlipChip, CSP, CGA, QFN, SMD |
| Software | INSPECTIS Basics BGA |
| Weight | 3.48 kg |
| Dimensions | 45 x 35 x 11 cm |
| Country of origin | Sweden |
| HS code | 85258099 |
Typical applications
Rework and repair of BGA assemblies, incoming and quality inspection, failure analysis of hidden solder joints, and documentation in the lab and on the line.
Made in Sweden by Inspectis.
| Weight | 3.480000 |
|---|---|
| Manufacturer | Inspectis |
| Manufacturer Nr. | BGA-003 |
| HS-Code | 85258099 |
| GPSR manufacturer information | A1-ESD equipment GmbH. Keldersstr. 15, DE-42697 Solingen, www.esd.equipment |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Sweden |
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