BGA Inspection System Light, hand-operated, 90-degree side-view - Inspectis BGA-003

Solder joints hidden under BGA, uBGA, FlipChip, CSP and QFN devices cannot be judged from the top. The hand-operated BGA Inspection System Light solves this with a 90-degree side-view prism probe that works like an inverted periscope, looking in under the package and bringing the concealed solder balls to the monitor as a sharp image.

Key benefits

• Side-view under the package: visual assessment of solder balls that top-down optics and even X-ray struggle to evaluate.
• 90-degree prism probe on the periscope principle for a clear lateral view along the solder rows.
• 5MP digital microscope with USB3.0 for high-resolution live images without a frame grabber.
• See from the first row up to 20 rows of BGA solder bumps thanks to adjustable background illumination.
• Hand-operated and portable: complete in an aluminium case, ideal for rework, repair and incoming inspection.

Typical applications

Rework and repair of BGA assemblies, incoming and quality inspection, failure analysis of hidden solder joints, and documentation in the lab and on the line.

Made in Sweden by Inspectis.