BGA reballing stencil made to component data - Reeco RE-SZABLON

Every BGA carries its own ball pattern. Pitch, ball diameter and layout differ from type to type, which is why no stencil fits two different components. The stencil is made for the specific package and meets its pads exactly.

Production needs a precise technical description of the component, or a sample sent in. Lead time depends on the type, and enquiries run through our sales team.

The stencil is made from aluminium alloys and is used in the RE-RKIT holder. The locking system and spacer beads of the holder keep the stencil flat on the component so the solder balls seat in one pass.

Benefits

• Made for the specific component, pads are met exactly
• Light and dimensionally stable aluminium alloy
• Used in the RE-RKIT holder, held flat by the locking system
• Solder balls placed in a single pass
• Reusable for that component type

Applications

Reballing of BGA and µBGA components in repair, laboratory work and the overhaul of industrial electronics.

Ordering

Please state the component type with its full technical specification, including pitch and ball count. Production is not possible without this data.