BGA reballing kit with aluminium stencil holder - Reeco RE-RKIT

Reballing stands or falls on alignment. If the stencil sits off by half a ball width, the solder balls land next to the pads and the component is lost. The RE-RKIT holder clamps component and stencil against each other and keeps both in place while the balls are filled in.

The frame is made from aluminium alloys, is light accordingly and stays true after many cycles. A locking system and spacer beads on the frame keep the stencil flat on the component.

The stencils themselves are not universal parts. Each one is made for the specific component, for which a precise technical description of the package is enough, or a sample of the component. It is ordered as RE-SZABLON.

Benefits

• Component and stencil stay exactly aligned while the balls are filled in
• Locking system and spacer beads keep the stencil flat
• Aluminium alloy frame, light and dimensionally stable
• Reusable, only the stencil is added per component type
• Fast sequence when placing the solder balls

Applications

Reballing of BGA and µBGA components in repair shops, electronics laboratories and the overhaul of industrial electronics.

Note on the stencil

The stencil is made per component, universal stencils do not exist. Production needs the component itself or its exact technical data.

Technical data