Hakko T51 Serie
Hakko Soldering and Desoldering Tips
The Hakko T51 series comprises precision soldering tips engineered for the Hakko FX-951 and FX-952 soldering stations, delivering tip temperatures stable to within ±1 °C at the point of contact through Hakko's integrated heater-and-thermocouple tip construction. Operating across a temperature range of 200-450 °C, T51 tips feature a composite copper-core design with iron plating and a working-surface finish that sustains thermal recovery rates fast enough for lead-free alloys (Sn-Ag-Cu, liquidus 217-221 °C), keeping idle drift below 5 °C between joints. Tip resistance from handle to working surface is kept below 2 Ω to support ESD-safe operation in accordance with IEC 61340-5-1 when used with a grounded station.
esd.equipment stocks 14 T51 tip variants - covering conical, bevel, chisel, and specialized profiles - sourced directly from Hakko's authorized distribution chain. Every tip ships in Hakko's original anti-static packaging, and the range is cross-referenced to IPC J-STD-001 process requirements for Class 2 and Class 3 assemblies, making it straightforward to select the correct geometry for pad sizes from 0.3 mm micro-SMD pads up to 5 mm through-hole lands.
Hakko T51 Series - Product Overview
| Tip Profile | Typical Application | Working Width / Diameter | Key Characteristic |
|---|---|---|---|
| Conical (BC) | Fine-pitch SMD, 0201-0402 components | 0.2-0.5 mm tip dia. | Maximum access precision |
| Bevel (B) | SOIC, QFP drag soldering | ca. 3 mm face | High heat transfer, angled contact |
| Chisel (D) | Through-hole, larger pads | 1-5 mm flat face | Broad surface contact, fast joint |
| Knife (KF) | IC lead trimming, drag on PLCC | Blade profile | Dual-edge access |
| Needle (I) | Ultra-fine rework, 0.3 mm pads | 0.2 mm point | Minimal thermal footprint |
Typical application areas: Electronics manufacturing and SMT assembly (IPC J-STD-001, IPC-A-610), semiconductor module rework (SEMI S1/S2), medical device PCB assembly (ISO 13485), automotive electronics production (IATF 16949, VDA 6.3), aerospace and defense board-level repair (AS9100), and precision laboratory or R&D soldering where repeatable tip temperature and ESD safety are mandatory (IEC 61340-5-1).