T51 series
Soldering and Desoldering Tips
The Hakko T51 series provides active soldering tips for chip and SOP applications on compatible Hakko stations. The core programme consists of chip tips (C05, I05, L1, L2, L3) and SOP tips in widths from 6 to 16 mm (L6, L8, L10, L13, L16), together with their LA variants (LA3, LA6, LA8, LA10). The L tip shape is designed to wet multiple pins of an SOP or chip component row simultaneously, enabling efficient tinning or desoldering of an entire pin row in a single pass.
| Part number | Shape | Width |
|---|---|---|
| T51-C05 | Chip bevel | 0.5 mm |
| T51-I05 | Chip needle | 0.5 mm |
| T51-L1, L2, L3 | Chip L shape | 1 / 2 / 3 mm |
| T51-L6, L8, L10, L13, L16 | SOP L shape | 6 / 8 / 10 / 13 / 16 mm |
| T51-LA3, LA6, LA8, LA10 | SOP LA variant | 3 / 6 / 8 / 10 mm |
Typical applications: SOP and SOIC component removal and installation by simultaneously heating all pins in a row (L6-L16), chip rework and fine soldering with C05/I05, rework on densely pinned IC packages, and production and rework in electronics assembly where row-by-row desoldering or soldering saves time and consumables.
