A Series

Soldering and Desoldering Tips

The Hakko A Series are hot-air nozzles for SMD rework stations. The programme covers QFP packages from 10x10 mm (A1125B) to 42.5x42.5 mm (A1215B), BQFP packages at 17x17 and 24x24 mm, SOP variants from 7.6x12.7 mm (A1258B) to 13x28 mm (A1259B), TSOL packages in three widths (13x10, 18x10, 18.5x8 mm), and PLCC packages from 9x9 mm (20-lead) to 14x11.5 mm (32-lead). All nozzles are matched to the Hakko FR-803/FR-810/FM-204 rework systems and direct the hot-air flow to suit the component footprint.

QFP coverage 10-42.5 mm - nozzles A1125B to A1215B for all standard QFP footprints
BQFP 17x17 and 24x24 mm - A1180B and A1182B for bumped QFP variants
📦 SOP 7.6x12.7 to 13x28 mm - four nozzle sizes A1258B-A1259B for narrow and wide SOP packages
TSOL nozzles - A1185B/A1186B/A1187B for three TSOL package sizes
PLCC 20-32 lead - A1188B, A1140B, A1141B, A1139B for package widths from 9x9 to 14x11.5 mm

Package typeDimensionModel
QFP10x10 mmA1125B
QFP12x12 mmA1262B
QFP14x14 mmA1126B
QFP14x20 mmA1128B
QFP17.5x17.5 mmA1127B
QFP20x20 mmA1261B
QFP28x28 mmA1129B
QFP35x35 mmA1203B
QFP40x40 mmA1264B
QFP42.5x42.5 mmA1215B
BQFP17x17 mmA1180B
BQFP24x24 mmA1182B
SOP7.6x12.7 mmA1258B
SOP13x28 mmA1259B
PLCC (20-lead)9x9 mmA1188B

Typical applications: Rework and desoldering of QFP/PLCC/SOP/TSOL components at SMT repair stations with Hakko FR-803/FR-810/FM-204 systems, repair after placement errors or solder defects in series production, laboratory rework and prototype modifications with changing package sizes, and component recovery processes for high-value SMD parts.

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  1. Hot Air Nozzle QFP 10×10 - Hakko A1125B
    €172.90
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