Hot Air Nozzle QFP 17.5×17.5mm - Hakko A1127B

Overview

The Hakko A1127B is a specialized hot air nozzle engineered for precise rework of QFP (Quad Flat Package) components with 17.5×17.5mm dimensions. This nozzle delivers controlled thermal distribution essential for reliable solder reflow on medium-sized surface-mount packages.

Key Features

• Optimized design for QFP 17.5×17.5mm packages
• Uniform heat distribution across component area
• Compatible with multiple Hakko hot air stations
• Durable construction for extended service life
• Precision-engineered for consistent rework results

Technical Specifications

Applications

Ideal for rework and repair of QFP integrated circuits in electronics manufacturing, repair shops, and laboratory environments. Suitable for prototype development and production-level component replacement.

Scope of Delivery

• 1× Hot air nozzle A1127B