Hot Air Nozzle QFP 10×10 - Hakko A1125B

Overview

The Hakko A1125B is a specialized hot air nozzle engineered for precise rework of QFP (Quad Flat Package) 10×10 components. This nozzle is compatible with multiple Hakko hot air stations, making it an essential accessory for electronics repair and PCB assembly operations requiring targeted thermal processing.

Key Features

• Optimized design for QFP 10×10 package geometry
• Compatible with Hakko 850, 852, FR-801, FR-802, and FR-803 stations
• Precision-engineered for uniform heat distribution
• Japanese manufacturing quality and reliability
• Durable construction for extended service life

Technical Specifications

Applications

Ideal for rework operations involving QFP 10×10 integrated circuits, including component removal, replacement, and repair on printed circuit boards in electronics manufacturing and repair facilities.