Hot Air Nozzle BGA 35×35 - Hakko A1476

Overview

The Hakko A1476 is a specialized hot air nozzle designed for BGA (Ball Grid Array) component rework. With a 35×35mm opening, it delivers focused thermal energy to large-pitch BGA packages during soldering and desoldering operations on compatible Hakko hot air rework stations.

Key Features

• 35×35mm nozzle opening optimized for BGA component heating
• Compatible with FR-801, FR-802, FR-803 and 850 hot air stations
• Precision-engineered for uniform heat distribution
• Durable construction for repeated rework cycles
• Quick-change design for efficient nozzle swapping

Technical Specifications

Applications

Ideal for rework and repair of BGA components on PCBs. Suitable for both lead-free and lead-based solder applications in electronics manufacturing, repair shops, and prototype development environments.