T16 Series
Soldering and Desoldering Tips
The Hakko T16 Series comprises 13 composite desoldering tips for T16-compatible Hakko handpieces. The range focuses on chip geometries (0.5I, 0.5C, 1L, 2L, 3L) and additional specialised profiles for desoldering SMD components across different pad sizes. The composite chip-format tips enable precise lift-off of chip resistors and capacitors without mechanical damage to adjacent components.
Composite desoldering tips - composite construction for even heat distribution during the desoldering process
Chip-format series - 0.5I, 0.5C, 1L, 2L, 3L for chip resistors and capacitors of different sizes
SMD desoldering - precise lift-off without mechanical stress on adjacent components or tracks
13 geometries - T16-1001 to T16-1013, matched to different chip package sizes
| Part number | Format | Chip package size |
|---|---|---|
| T16-1001 | 0.5I Chip | Small SMD chips, 0402-0603 |
| T16-1002 | 0.5C Chip | Small SMD chips, 0402-0603 |
| T16-1003 | Chip 1L | SMD chip 0805 |
| T16-1004 | 2L Chip | SMD chip 1206 |
| T16-1013 | Chip 3L | Larger SMD chips 1812-2220 |
Typical applications: Rework of chip resistors and capacitors in SMT assembly lines, component replacement during PCB repair, touch-up and desoldering in quality assurance, and pad cleaning on densely populated boards in ESD-protected work areas.
