Composite Desoldering Tip SOP 13L - Hakko T16-1008

Overview

The Hakko T16-1008 is a composite desoldering tip specifically engineered for the FM 2022 parallel desoldering tweezers system. Designed in SOP 13L format, this tip enables precise and efficient removal of solder from surface-mount devices without damaging delicate PCB traces or component leads.

Key Features

• SOP 13L format optimized for parallel desoldering tweezers
• Composite construction for enhanced durability and thermal performance
• Compatible with Hakko FM 2022 desoldering system
• Pack of 2 tips for extended operational use
• Designed for surface-mount component desoldering
• Precision-engineered for consistent solder removal

Technical Specifications

Applications

Ideal for rework and repair operations involving surface-mount devices in SOP 13L packages. Suitable for electronics manufacturing, PCB assembly, and component-level repair where precision desoldering is required.

Scope of Delivery

• 2 × Composite Desoldering Tip SOP 13L